EPF10K100BFC256-3 vs EPF10K100ARC240-3N Comparison
Detailed side-by-side comparison of EPF10K100BFC256-3 by Intel and EPF10K100ARC240-3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K100BFC256-3 | EPF10K100ARC240-3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | NRND |
| Family | FLEX 10KE | FLEX 10KA |
| Typical Gates | 100,000 | — |
| Logic Elements (LEs) | 4,992 | — |
| Embedded Array Blocks (EABs) | 12 | — |
| Total RAM Bits | 24,576 | — |
| Maximum Operating Frequency | 200 MHz | — |
| Process Technology | 0.22 µm CMOS SRAM | 0.3 µm CMOS |
| Core Supply Voltage | 2.5 V (range 2.3 V to 2.7 V) | 3.3 V |
| Speed Grade | -3 | -3 |
| Package | 256-pin FineLine BGA (FBGA) | 240-RQFP (BFQFP with exposed pad) |
| User I/O Pins (max) | [DATA_NEEDED: exact user I/O count for BFC256 package] | — |
| Operating Temperature Range | 0 °C to 70 °C | — |
| Configuration Method | SRAM, requires external config device | — |
| JTAG Boundary Scan | IEEE Std. 1149.1-1990 compliant | — |
| PCI Compliance | PCI Local Bus Spec Rev. 2.2 (3.3 V, -3 speed grade) | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| MSL Level | [DATA_NEEDED: MSL rating] | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance] |
| Series | — | FLEX 10K |
| System Gates | — | 100,000 |
| Logic Elements (LE) | — | 4,992 |
| Logic Array Blocks (LAB) | — | 624 |
| Embedded Array Blocks (EAB) | — | 12 |
| On-chip RAM | — | 24,576 bits (24.18 kbit) |
| User I/Os | — | 189 |
| Propagation Delay | — | 0.6000 ns |
| Operating Temperature | — | 0 °C to 70 °C (commercial) |
| Configuration | — | JTAG / passive serial / passive parallel / active serial |