EPF10K100EBC356-1 vs EPF10K100EBC356-1X Comparison
Detailed side-by-side comparison of EPF10K100EBC356-1 by Intel and EPF10K100EBC356-1X by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K100EBC356-1 | EPF10K100EBC356-1X |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | NRND |
| Family | FLEX 10KE | — |
| System Gates | 100,000 | — |
| Logic Elements | 4,992 | 4,992 |
| Embedded Memory | 49,152 bits | — |
| User I/Os | 274 | — |
| Package | 356-LBGA | — |
| Process Technology | 0.22 µm CMOS | — |
| Core Voltage | 2.5 V | — |
| I/O Voltage | 2.5 V / 3.3 V | — |
| Internal Frequency | 333.33 MHz | — |
| Propagation Delay | 0.6 ns | 0.6 ns |
| Operating Temperature | 0 °C to 70 °C | 0 C to +70 C (Commercial) |
| JTAG (IEEE 1149.1) | Yes | — |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Logic Family | CMOS | CMOS |
| RoHS Status | Unknown - pre-RoHS design | [DATA_NEEDED: RoHS status] |
| MSL Level | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL rating] |
| Series | — | FLEX 10KE |
| Typical Gates | — | 100,000 |
| Logic Array Blocks (LABs) | — | 624 |
| Embedded Array Blocks (EABs) | — | 12 |
| Total RAM Bits | — | 49,152 |
| User I/O Count | — | 274 |
| Core Process Technology | — | 0.22 um CMOS, 5 metal layers |
| Core Supply Voltage | — | 2.5 V (2.375 V to 2.625 V) |
| I/O Supply Voltage | — | 3.3 V (multi-volt tolerant to 5 V) |
| Package Type | — | 356-LBGA (BGA-356) |
| Package Dimensions | — | 35 x 35 mm, 1.27 mm ball pitch |
| Speed Grade | — | -1X |
| Configuration Method | — | Serial EPROM / Parallel EPROM / JTAG (IEEE 1149.1) |