EPF10K100EBC356-3 vs EPF10K130EBC356-1X Comparison
Detailed side-by-side comparison of EPF10K100EBC356-3 by Intel and EPF10K130EBC356-1X by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF10K130EBC356-1X - FLEX 10KE FPGA 130K Gates BGA-356 | Intel / Altera
EPF10K130EBC356-1X ObsoleteSpecification Comparison
| Parameter | EPF10K100EBC356-3 | EPF10K130EBC356-1X |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Family | FLEX-10KE | FLEX 10KE (embedded programmable logic) |
| Logic Elements / Cells | 4,992 | — |
| Total Gates | ~100,000 | — |
| Logic Array Blocks (LABs) | 624 | 832 |
| Embedded Memory (RAM bits) | 49,152 | — |
| User I/Os | 274 | 274 |
| Supply Voltage (Core) | 2.5 V (2.375 V to 2.625 V) | — |
| Speed Grade | -3 | — |
| Propagation Delay (typical) | 0.6 ns | — |
| Maximum Internal Frequency | 200 MHz | — |
| Process Technology | 0.22 micron CMOS | 0.22 um CMOS |
| Configuration Technology | SRAM (volatile) | — |
| Operating Temperature | 0 C to 70 C (Commercial) | 0 C to 70 C (commercial) |
| Package | 356-LBGA (35 x 35 mm) | 356-LBGA (35x35 mm) |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance status] |
| Series | — | FLEX 10KE |
| Logic Cells | — | 6,656 |
| System Gates | — | 130,000 |
| Embedded Array Blocks (EABs) | — | Yes (RAM/ROM/FIFO) |
| Propagation Delay | — | 0.6 ns |
| Max Internal Frequency | — | 333.33 MHz |
| Core Supply Voltage | — | 2.5 V (2.375 V - 2.625 V) |
| Configuration Memory | — | SRAM (external config EPROM required) |