EPF10K100EBC356-3 vs EPF10K130EBC356-1X Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K100EBC356-3 sa pamamagitan ng Intel at EPF10K130EBC356-1X sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K130EBC356-1X - FLEX 10KE FPGA 130K Gates BGA-356 | Intel / Altera
EPF10K130EBC356-1X ObsoletePagsanggunian na paghahambing
| Parametro | EPF10K100EBC356-3 | EPF10K130EBC356-1X |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | FLEX-10KE | FLEX 10KE (embedded programmable logic) |
| Logic Elements / Cells | 4,992 | — |
| Total Gates | ~100,000 | — |
| Logic Array Blocks (LABs) | 624 | 832 |
| Embedded Memory (RAM bits) | 49,152 | — |
| User I/Os | 274 | 274 |
| Supply Voltage (Core) | 2.5 V (2.375 V to 2.625 V) | — |
| Speed Grade | -3 | — |
| Propagation Delay (typical) | 0.6 ns | — |
| Maximum Internal Frequency | 200 MHz | — |
| Process Technology | 0.22 micron CMOS | 0.22 um CMOS |
| Configuration Technology | SRAM (volatile) | — |
| Temperature na Operasyon | 0 C to 70 C (Commercial) | 0 C to 70 C (commercial) |
| Packhaging | 356-LBGA (35 x 35 mm) | 356-LBGA (35x35 mm) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance status] |
| Series | — | FLEX 10KE |
| Logic Cells | — | 6,656 |
| System Gates | — | 130,000 |
| Embedded Array Blocks (EABs) | — | Yes (RAM/ROM/FIFO) |
| Propagation Delay | — | 0.6 ns |
| Max Internal Frequency | — | 333.33 MHz |
| Core Supply Voltage | — | 2.5 V (2.375 V - 2.625 V) |
| Configuration Memory | — | SRAM (external config EPROM required) |