EPF10K100EFC484-1X vs EPF10K100EFC484-3N Comparison
Detailed side-by-side comparison of EPF10K100EFC484-1X by Intel and EPF10K100EFC484-3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K100EFC484-1X | EPF10K100EFC484-3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | NRND | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| Series | FLEX-10KE® | — |
| Logic Elements / Cells | 4992 | 4992 |
| System Gates | 100,000 | — |
| Logic Array Blocks (LABs) | 624 | 624 |
| Total RAM Bits | 49,152 | — |
| User I/O Count | 338 | — |
| Number of I/O Pins | 338 (package provides up to 488 bonded I/O pads) | — |
| Supply Voltage (Core) | 2.5 V (2.375 V – 2.625 V) | — |
| Supply Voltage (I/O) | 3.3 V | — |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS |
| Maximum Internal Frequency | 333.33 MHz | — |
| Propagation Delay | 0.6 ns (per logic element, typical) | — |
| Package | 484-FBGA (FineLine BGA, 23 × 23 mm) | 484-ball FineLine BGA (FC484 / FBGA-484) |
| Operating Temperature | 0 °C to +70 °C (commercial) | — |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Programming Interface | JTAG / serial (ByteBlaster-compatible) | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | — |
| Total Gates | — | 100,000 |
| Embedded Memory (EAB) | — | 49,152 bits (12 EABs) |
| User I/Os | — | 338 |
| Core Voltage (VCCINT) | — | 2.5 V |
| I/O Voltage (VCCIO) | — | MultiVolt (2.5 V / 3.3 V / 5.0 V tolerant per bank) |
| Internal Performance | — | 200 MHz |
| Speed Grade | — | -3 (fastest commercial bin) |
| Temperature Grade | — | Commercial (0 °C to +70 °C) |
| Configuration Method | — | SRAM (external EPROM/Flash/JTAG required at power-up) |
| Lead-Free / RoHS | — | Yes (N suffix = lead-free) |