EPF10K100EFC484-3N vs EPF10K100EFC484-1X Comparison
Detailed side-by-side comparison of EPF10K100EFC484-3N by Intel and EPF10K100EFC484-1X by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K100EFC484-3N | EPF10K100EFC484-1X |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | NRND |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements / Cells | 4992 | 4992 |
| Total Gates | 100,000 | — |
| Embedded Memory (EAB) | 49,152 bits (12 EABs) | — |
| Logic Array Blocks (LABs) | 624 | 624 |
| User I/Os | 338 | — |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS |
| Core Voltage (VCCINT) | 2.5 V | — |
| I/O Voltage (VCCIO) | MultiVolt (2.5 V / 3.3 V / 5.0 V tolerant per bank) | — |
| Internal Performance | 200 MHz | — |
| Speed Grade | -3 (fastest commercial bin) | — |
| Package | 484-ball FineLine BGA (FC484 / FBGA-484) | 484-FBGA (FineLine BGA, 23 × 23 mm) |
| Temperature Grade | Commercial (0 °C to +70 °C) | — |
| Configuration Method | SRAM (external EPROM/Flash/JTAG required at power-up) | — |
| Lead-Free / RoHS | Yes (N suffix = lead-free) | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Series | — | FLEX-10KE® |
| System Gates | — | 100,000 |
| Total RAM Bits | — | 49,152 |
| User I/O Count | — | 338 |
| Number of I/O Pins | — | 338 (package provides up to 488 bonded I/O pads) |
| Supply Voltage (Core) | — | 2.5 V (2.375 V – 2.625 V) |
| Supply Voltage (I/O) | — | 3.3 V |
| Maximum Internal Frequency | — | 333.33 MHz |
| Propagation Delay | — | 0.6 ns (per logic element, typical) |
| Operating Temperature | — | 0 °C to +70 °C (commercial) |
| Programming Interface | — | JTAG / serial (ByteBlaster-compatible) |
| RoHS Status | — | [DATA_NEEDED: RoHS status] |