EPF10K130EBC356-1X vs EPF10K100EBC356-1X Comparison
Detailed side-by-side comparison of EPF10K130EBC356-1X by Intel and EPF10K100EBC356-1X by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF10K130EBC356-1X - FLEX 10KE FPGA 130K Gates BGA-356 | Intel / Altera
EPF10K130EBC356-1X ObsoleteSpecification Comparison
| Parameter | EPF10K130EBC356-1X | EPF10K100EBC356-1X |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | NRND |
| Series | FLEX 10KE | FLEX 10KE |
| Family | FLEX 10KE (embedded programmable logic) | — |
| Logic Cells | 6,656 | — |
| Logic Array Blocks (LABs) | 832 | 624 |
| System Gates | 130,000 | — |
| Embedded Array Blocks (EABs) | Yes (RAM/ROM/FIFO) | 12 |
| User I/Os | 274 | — |
| Propagation Delay | 0.6 ns | 0.6 ns |
| Max Internal Frequency | 333.33 MHz | — |
| Process Technology | 0.22 um CMOS | — |
| Core Supply Voltage | 2.5 V (2.375 V - 2.625 V) | 2.5 V (2.375 V to 2.625 V) |
| Operating Temperature | 0 C to 70 C (commercial) | 0 C to +70 C (Commercial) |
| Package | 356-LBGA (35x35 mm) | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| Configuration Memory | SRAM (external config EPROM required) | — |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Logic Elements | — | 4,992 |
| Typical Gates | — | 100,000 |
| Total RAM Bits | — | 49,152 |
| User I/O Count | — | 274 |
| Logic Family | — | CMOS |
| Core Process Technology | — | 0.22 um CMOS, 5 metal layers |
| I/O Supply Voltage | — | 3.3 V (multi-volt tolerant to 5 V) |
| Package Type | — | 356-LBGA (BGA-356) |
| Package Dimensions | — | 35 x 35 mm, 1.27 mm ball pitch |
| Speed Grade | — | -1X |
| Configuration Method | — | Serial EPROM / Parallel EPROM / JTAG (IEEE 1149.1) |
| MSL Level | — | [DATA_NEEDED: MSL rating] |