EPF10K200EFC672-2 vs EPF10K200SFI672-2 Comparison

Detailed side-by-side comparison of EPF10K200EFC672-2 by Intel and EPF10K200SFI672-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200EFC672-2 EPF10K200SFI672-2
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status NRND Obsolete
Family FLEX 10KE FLEX 10KE
Logic Elements 9,984 9984
Typical Gates 200,000 —
Maximum User I/Os 470 —
Embedded Memory 98,304 bits —
Embedded Array Blocks (EABs) 12 24
Logic Array Blocks (LABs) 624 1248
Package 672-BBGA (FineLine BGA) 672-pin FineLine BGA (FBGA)
Package Dimensions 45 x 45 mm —
Ball Pitch 1.27 mm —
Process Technology 0.22 um CMOS 0.22 µm (Arrow lists 0.42 µm)
Speed Grade -2 -2
Propagation Delay 0.4 ns —
Operating Temperature 0 C to 70 C Industrial (-40C to +85C)
Supply Voltage (Core) [DATA_NEEDED: core Vcc] —
Programmability JTAG (IEEE 1149.1) / in-system —
RoHS Status Compliant (per distributor listing) Not compliant (per Arrow EU RoHS listing)
Logic Family CMOS —
System Gates — 200000
User I/Os — 470
Embedded Memory (EAB SRAM) — 96 Kbit
Distributed Memory — 98304 bits
Core Supply Voltage — 2.5 V
JTAG Boundary Scan — IEEE Std. 1149.1-1990 compliant
PCI Compliance — PCI Local Bus Specification Rev 2.2 (3.3 V, 33/66 MHz) on -1 speed grade
Programming — SRAM-based, in-system programmable

Datasheets & Resources

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