EPF10K200EFC672-2 vs EPF10K250EFC672-1 Comparison
Detailed side-by-side comparison of EPF10K200EFC672-2 by Intel and EPF10K250EFC672-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K200EFC672-2 | EPF10K250EFC672-1 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | NRND | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements | 9,984 | — |
| Typical Gates | 200,000 | — |
| Maximum User I/Os | 470 | 470 |
| Embedded Memory | 98,304 bits | — |
| Embedded Array Blocks (EABs) | 12 | — |
| Logic Array Blocks (LABs) | 624 | — |
| Package | 672-BBGA (FineLine BGA) | — |
| Package Dimensions | 45 x 45 mm | — |
| Ball Pitch | 1.27 mm | 1.27 mm |
| Process Technology | 0.22 um CMOS | — |
| Speed Grade | -2 | -1 |
| Propagation Delay | 0.4 ns | 0.4 ns |
| Operating Temperature | 0 C to 70 C | 0C to +70C (Commercial) |
| Supply Voltage (Core) | [DATA_NEEDED: core Vcc] | — |
| Programmability | JTAG (IEEE 1149.1) / in-system | — |
| RoHS Status | Compliant (per distributor listing) | [DATA_NEEDED: RoHS status] |
| Logic Family | CMOS | CMOS |
| Typical System Gates | — | 250,000 |
| Total Pins | — | 672 |
| Package Type | — | BGA-672 |
| Package Size | — | 45 x 45 mm |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| Programming Technology | — | In-system, SRAM-based |
| Mounting Type | — | Surface Mount |
| Configuration Interface | — | Serial (passive/active) |