EPF10K200SBC356-2X vs EPF10K200SBC356-1 Comparison

Detailed side-by-side comparison of EPF10K200SBC356-2X by Intel and EPF10K200SBC356-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200SBC356-2X EPF10K200SBC356-1
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status NRND NRND
Series FLEX-10KS —
Family FLEX 10K FLEX 10K (Classic embedded array)
Logic Elements / Cells 9984 9,984
Approximate Gate Count 200,000 —
Logic Array Blocks (LABs) 1248 —
User I/O Count 274 —
Package 356-LBGA (35x35 mm, 1.27 mm pitch) 356-LBGA (35 x 35 mm, 1.27 mm pitch)
Supply Voltage 2.375 V to 2.625 V (core) —
Process Technology CMOS 0.22 µm —
Propagation Delay (typ.) 0.4 ns —
Speed Grade -2 —
Operating Temperature 0 °C to +70 °C (commercial) 0 °C to 70 °C (commercial)
Mounting Type Surface Mount Surface Mount
Lead Free Status / RoHS RoHS non-compliant (per third-party listing) —
Configuration Method SRAM-based, requires external configuration device (EPC2/EPC8) SRAM (volatile) - requires configuration device or JTAG
In-System Programmability Yes (via JTAG or serial interface) —
Number of LABs / CLBs — 1,248
Total RAM Bits — 98,304
Equivalent Gate Count — 200,000 (system gates ~513,000)
Number of User I/Os — 274
Propagation Delay — 0.4 ns (-1 speed grade)
Core Supply Voltage — 2.375 V to 2.625 V
Logic Family / Process — CMOS SRAM LUT
RoHS Status — [DATA_NEEDED: RoHS status]
MSL Level — [DATA_NEEDED: MSL level]

Datasheets & Resources

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