EPF10K200SFC484-1N vs EPF10K200SFC484-2X Comparison

Detailed side-by-side comparison of EPF10K200SFC484-1N by Intel and EPF10K200SFC484-2X by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EPF10K200SFC484-1N EPF10K200SFC484-1N - FLEX-10KE FPGA 200K Gates 484-FBGA | Intel

EPF10K200SFC484-1N - FLEX-10KE FPGA 200K Gates 484-FBGA | Intel

EPF10K200SFC484-1N ⚠ Last Time Buy

Specification Comparison

Parameter EPF10K200SFC484-1N EPF10K200SFC484-2X
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last Time Buy NRND
Series FLEX-10KE FLEX 10KS
Family FLEX-10KS FLEX 10K
Logic Elements 9,984 —
System Gates 200,000 —
Logic Array Blocks (LABs) 1,248 —
Embedded Memory (EAB) 98,304 bits —
User I/Os 369 —
Core Voltage 2.5 V —
Process Technology 0.22 µm CMOS [DATA_NEEDED: process node nm]
Maximum Internal Frequency 250 MHz —
Pin-to-Pin Delay 0.3 ns —
Package 484-FBGA (FineLine BGA), 23 x 23 mm, 1.0 mm pitch —
Mounting Type Surface Mount Surface Mount
Operating Temperature 0 °C to +70 °C (Commercial) 0C to +70C (commercial)
Configuration Method SRAM (volatile) - IEEE 1149.1 JTAG —
RoHS Status Compliant [DATA_NEEDED: rohs status]
Speed Grade -1 (fastest) —
Number of Logic Elements / Cells — 9984
Number of LABs / CLBs — 1248
Total RAM Bits — 98304
Number of Gates — 200000 (typical)
Number of I/O — 369
Core Voltage - Supply — 2.375 V to 2.625 V
Operating Frequency (max) — 250 MHz (family-typical, -2 speed grade)
Package / Case — 484-BBGA (FineLine BGA)
Supplier Device Package — 484-FBGA (23 x 23 mm, 1.0 mm pitch)
Technology — CMOS, SRAM-based configuration
Configuration Memory — External serial (EPC1/EPC2 family compatible)
JTAG Support — IEEE 1149.1-1990 boundary-scan

Datasheets & Resources

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