EPF10K200SFC484-2N vs EPF10K130EFC484-3N Comparison

Detailed side-by-side comparison of EPF10K200SFC484-2N by Intel and EPF10K130EFC484-3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200SFC484-2N EPF10K130EFC484-3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $95.00 $109.25
Family FLEX 10KE β€”
Logic Elements / Cells 9,984 β€”
Gate Count 200,000 β€”
Logic Array Blocks (LABs) 1,248 β€”
Embedded RAM Bits 98,304 (96 Kbit) β€”
User I/O Pins 369 β€”
Number of I/Os (alt spec) 470 (per digchip datasheet summary) β€”
Core Supply Voltage 2.375 V to 2.625 V (2.5 V nominal) β€”
Internal Performance 200 MHz β€”
Propagation Delay 0.4 ns β€”
Process Technology 0.22 Β΅m CMOS 0.22 Β΅m CMOS
Operating Temperature 0Β°C to 70Β°C (Commercial) β€”
Package 484-FBGA FineLine BGA, 23 x 23 mm, 1.0 mm pitch β€”
Mounting Type Surface Mount Surface Mount
Programming Interface JTAG (IEEE 1149.1), SRAM configuration β€”
I/O Standard Support 5 V-tolerant, MultiVolt (1.8 V / 2.5 V / 3.3 V) β€”
Logic Family CMOS β€”
Compliance / Lead Status [DATA_NEEDED: RoHS status] β€”
Series β€” FLEX-10KE
Number of Logic Elements / Cells β€” 6656
Total RAM Bits β€” 65536
Typical Gate Count β€” 130000
Number of I/O β€” 369
Number of LABs/CLBs β€” 832
Number of Embedded Array Blocks (EABs) β€” 72
Speed Grade β€” -3 (faster timing bin)
Operating Temperature Grade β€” Commercial (0C to +70C)
Core Voltage β€” 2.5 V
Package Type β€” 484-BBGA (FineLine BGA)
Package Dimensions β€” 23 x 23 mm
Ball Pitch β€” 1.0 mm
Configuration Memory β€” SRAM-based (volatile, requires config device)
RoHS Status β€” [DATA_NEEDED: RoHS status]
Configuration Interface β€” JTAG / PS / PPS / Altera serial

Datasheets & Resources

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