EPF10K200SFC484-3 vs EPF10K200SBC600-3 Comparison
Detailed side-by-side comparison of EPF10K200SFC484-3 by Intel and EPF10K200SBC600-3 by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF10K200SFC484-3 - 200K Gate FLEX-10KS FPGA 484-BGA | Intel / Altera
EPF10K200SFC484-3 Obsolete
Specification Comparison
| Parameter | EPF10K200SFC484-3 | EPF10K200SBC600-3 |
|---|---|---|
| Brand | Intel | Altera |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Series | FLEX-10KS | — |
| Family | FLEX 10K | FLEX 10KE |
| System Gates | 200,000 | — |
| Logic Cells | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | 1,248 |
| User I/O Pins | 369 | — |
| Core Voltage | 2.375 V to 2.625 V | 2.5 V |
| Process Technology | 0.22 µm CMOS SRAM | 0.22 µm CMOS |
| Maximum Internal Frequency | 166.67 MHz | 166.67 MHz |
| Embedded Memory (RAM bits) | 40,960 (via EABs) | — |
| Global Clock Networks | 4 | — |
| Package | 484-Ball FineLine BGA (PBGA484) | 600-ball BGA (PBGA600, 45 x 45 mm, 1.27 mm pitch) |
| Package Dimensions | 23 mm × 23 mm, 1.0 mm pitch | — |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0 °C to +70 °C (Commercial) | 0 °C to 70 °C (commercial) |
| Configuration Method | SRAM, JTAG, EPC2 PROM | SRAM (external PROM required) |
| I/O Standards | 3.3 V LVTTL/LVCMOS, 5.0 V PCI | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Status | Obsolete (last shipped 2007-2010, available via brokers) | Obsolete (last Altera shipment) |
| Logic Elements | — | 9,984 cells |
| Gate Count | — | 200,000 gates |
| Embedded Memory | — | 98,304 bits |
| Embedded Array Blocks (EABs) | — | 12 |
| User I/Os | — | 470 |
| Programming Support | — | JTAG / Altera Quartus legacy |