EPF10K200SFC484-3 vs EPF10K200SBC600-3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200SFC484-3 sa pamamagitan ng Intel at EPF10K200SBC600-3 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K200SFC484-3 - 200K Gate FLEX-10KS FPGA 484-BGA | Intel / Altera
EPF10K200SFC484-3 ObsoletePagsanggunian na paghahambing
| Parametro | EPF10K200SFC484-3 | EPF10K200SBC600-3 |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Series | FLEX-10KS | — |
| Family | FLEX 10K | FLEX 10KE |
| System Gates | 200,000 | — |
| Logic Cells | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | 1,248 |
| User I/O Pins | 369 | — |
| Core Voltage | 2.375 V to 2.625 V | 2.5 V |
| Process Technology | 0.22 µm CMOS SRAM | 0.22 µm CMOS |
| Maximum Internal Frequency | 166.67 MHz | 166.67 MHz |
| Embedded Memory (RAM bits) | 40,960 (via EABs) | — |
| Global Clock Networks | 4 | — |
| Packhaging | 484-Ball FineLine BGA (PBGA484) | 600-ball BGA (PBGA600, 45 x 45 mm, 1.27 mm pitch) |
| Package Dimensions | 23 mm × 23 mm, 1.0 mm pitch | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | 0 °C to +70 °C (Commercial) | 0 °C to 70 °C (commercial) |
| Configuration Method | SRAM, JTAG, EPC2 PROM | SRAM (external PROM required) |
| I/O Standards | 3.3 V LVTTL/LVCMOS, 5.0 V PCI | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Status | Obsolete (last shipped 2007-2010, available via brokers) | Obsolete (last Altera shipment) |
| Logic Elements | — | 9,984 cells |
| Gate Count | — | 200,000 gates |
| Embedded Memory | — | 98,304 bits |
| Embedded Array Blocks (EABs) | — | 12 |
| User I/Os | — | 470 |
| Programming Support | — | JTAG / Altera Quartus legacy |