EPF10K20RC240-3N vs EPF10K20RC240-4 Comparison
Detailed side-by-side comparison of EPF10K20RC240-3N by Altera and EPF10K20RC240-4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K20RC240-3N | EPF10K20RC240-4 |
|---|---|---|
| Brand | Altera | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Series | FLEX 10K | — |
| Family | Embedded Programmable Logic Device (EPLD) | FLEX 10K |
| Logic Cells / Elements | 1152 | — |
| Total Gates | 20,000 (typical usable) | — |
| Logic Capacity (typical) | 12,888 | — |
| Logic Array Blocks (LABs) | 144 | 144 |
| User I/O Pins | 189 | — |
| Embedded Array Blocks (EABs) | 6 (per family architecture) | — |
| Number of Pins | 240 | — |
| Package Type | 240-RQFP (HFQFP, exposed pad) | — |
| Package Code | HFQFP / RQFP | — |
| Mounting Type | Surface Mount (gull wing) | Surface Mount |
| Supply Voltage | 5 V | 5 V |
| Technology / Process | 0.42 µm CMOS | — |
| Maximum Internal Frequency | 125 MHz | — |
| Propagation Delay | 0.4 ns (typical) | 0.4 ns (per DigChip) |
| Speed Grade | -3 | -4 |
| Operating Temperature | 0 °C to +70 °C (commercial) | 0 °C to 70 °C |
| Programming Interface | JTAG (IEEE 1149.1), ByteBlaster / MasterBlaster / ByteBlasterMV | — |
| Configuration Memory | SRAM (volatile, re-programmable) | — |
| RoHS Status | [DATA_NEEDED: RoHS compliance] | non_compliant (legacy BFQFP, SnPb finish) |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Typical Gates | — | 20,000 |
| Logic Elements / Cells | — | 1,152 |
| User I/Os | — | 189 |
| Package | — | 240-BFQFP Exposed Pad (RQFP) |
| Pin Count | — | 240 |
| Process Technology | — | 0.42 µm CMOS |
| MSL Level | — | [DATA_NEEDED: MSL Level] |
| Embedded Memory | — | EAB (Embedded Array Block) SRAM/ROM |