EPF10K20RC240-4 vs EPF10K20RC240-3N Comparison

Detailed side-by-side comparison of EPF10K20RC240-4 by Intel and EPF10K20RC240-3N by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K20RC240-4 EPF10K20RC240-3N
Brand Intel Altera
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Family FLEX 10K Embedded Programmable Logic Device (EPLD)
Typical Gates 20,000 —
Logic Elements / Cells 1,152 —
Logic Array Blocks (LABs) 144 144
User I/Os 189 —
Package 240-BFQFP Exposed Pad (RQFP) —
Pin Count 240 —
Supply Voltage 5 V 5 V
Process Technology 0.42 µm CMOS —
Operating Temperature 0 °C to 70 °C 0 °C to +70 °C (commercial)
Speed Grade -4 -3
Propagation Delay 0.4 ns (per DigChip) 0.4 ns (typical)
Mounting Type Surface Mount Surface Mount (gull wing)
MSL Level [DATA_NEEDED: MSL Level] —
RoHS Status non_compliant (legacy BFQFP, SnPb finish) [DATA_NEEDED: RoHS compliance]
Embedded Memory EAB (Embedded Array Block) SRAM/ROM —
Series — FLEX 10K
Logic Cells / Elements — 1152
Total Gates — 20,000 (typical usable)
Logic Capacity (typical) — 12,888
User I/O Pins — 189
Embedded Array Blocks (EABs) — 6 (per family architecture)
Number of Pins — 240
Package Type — 240-RQFP (HFQFP, exposed pad)
Package Code — HFQFP / RQFP
Technology / Process — 0.42 µm CMOS
Maximum Internal Frequency — 125 MHz
Programming Interface — JTAG (IEEE 1149.1), ByteBlaster / MasterBlaster / ByteBlasterMV
Configuration Memory — SRAM (volatile, re-programmable)
Lead-Free — [DATA_NEEDED: lead-free status]

Datasheets & Resources

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