EPF10K250EGC599-1 vs EPF10K250EGC599-2 Comparison
Detailed side-by-side comparison of EPF10K250EGC599-1 by Intel and EPF10K250EGC599-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K250EGC599-1 | EPF10K250EGC599-2 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | NRND | NRND |
| Product Type | FPGA (Field-Programmable Gate Array) | — |
| Series | FLEX 10K | — |
| Logic Elements | 40,960 | 12,160 LEs |
| Equivalent Gates | 250,000 | — |
| Flip-Flops | 12,160 | — |
| User I/O Pins | 470 | — |
| Embedded Array Blocks (EAB) | 20 (2 Kbit each) | — |
| Package | 599-BPGA / HIPGA-599 (Ceramic Pin Grid Array) | 599-BCPGA (CPGA-599 / HIPGA-599) |
| Pin Count | 599 | — |
| Operating Temperature | 0C to +70C (Commercial) | — |
| Mounting Type | Through-Hole (PGA) | Through-Hole (Pin Grid Array) |
| Configuration | SRAM (volatile), serial/parallel EPROM | — |
| Process Node | 0.42 µm CMOS | — |
| I/O Standard Support | 5.0 V PCI, LVTTL, LVCMOS | — |
| Programming Interface | JTAG (IEEE 1149.1), passive serial | — |
| MSL Level | [DATA_NEEDED: moisture sensitivity level] | — |
| RoHS Status | unknown (ceramic HIPGA package historically non-RoHS) | Unknown (legacy ceramic PGA) |
| Family | — | FLEX 10KE |
| Typical Gates | — | 250,000 |
| Maximum User I/O Pins | — | 470 |
| Embedded Array Blocks (EABs) | — | 12 |
| Total RAM Bits | — | 24,576 bits |
| Number of PLLs | — | 4 |
| Speed Grade | — | -2 |
| Operating Temperature Grade | — | Commercial |
| Core Voltage | — | 5 V |
| Configuration Method | — | SRAM / EPROM |
| JTAG Support | — | IEEE 1149.1 Boundary Scan |
| Lifecycle Status | — | Not Recommended for New Designs (NRND) |