EPF10K250EGC599-1 vs EPF10K250EGC599-2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K250EGC599-1 sa pamamagitan ng Intel at EPF10K250EGC599-2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF10K250EGC599-1 | EPF10K250EGC599-2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Product Type | FPGA (Field-Programmable Gate Array) | — |
| Series | FLEX 10K | — |
| Logic Elements | 40,960 | 12,160 LEs |
| Equivalent Gates | 250,000 | — |
| Flip-Flops | 12,160 | — |
| User I/O Pins | 470 | — |
| Embedded Array Blocks (EAB) | 20 (2 Kbit each) | — |
| Packhaging | 599-BPGA / HIPGA-599 (Ceramic Pin Grid Array) | 599-BCPGA (CPGA-599 / HIPGA-599) |
| Bilang ng Pin | 599 | — |
| Temperature na Operasyon | 0C to +70C (Commercial) | — |
| Uri ng Pagpapasok | Through-Hole (PGA) | Through-Hole (Pin Grid Array) |
| Configuration | SRAM (volatile), serial/parallel EPROM | — |
| Process Node | 0.42 µm CMOS | — |
| I/O Standard Support | 5.0 V PCI, LVTTL, LVCMOS | — |
| Programming Interface | JTAG (IEEE 1149.1), passive serial | — |
| Level ng MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Tindminan RoHS | unknown (ceramic HIPGA package historically non-RoHS) | Unknown (legacy ceramic PGA) |
| Family | — | FLEX 10KE |
| Typical Gates | — | 250,000 |
| Maximum User I/O Pins | — | 470 |
| Embedded Array Blocks (EABs) | — | 12 |
| Total RAM Bits | — | 24,576 bits |
| Number of PLLs | — | 4 |
| Speed Grade | — | -2 |
| Operating Temperature Grade | — | Commercial |
| Core Voltage | — | 5 V |
| Configuration Method | — | SRAM / EPROM |
| JTAG Support | — | IEEE 1149.1 Boundary Scan |
| Katayuan ng Lifecycle | — | Not Recommended for New Designs (NRND) |