EPF10K250EGC599-1 vs EPF10K250EGI599-3 Comparison
Detailed side-by-side comparison of EPF10K250EGC599-1 by Intel and EPF10K250EGI599-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K250EGC599-1 | EPF10K250EGI599-3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | NRND | NRND |
| Product Type | FPGA (Field-Programmable Gate Array) | — |
| Series | FLEX 10K | FLEX 10KE |
| Logic Elements | 40,960 | — |
| Equivalent Gates | 250,000 | — |
| Flip-Flops | 12,160 | — |
| User I/O Pins | 470 | — |
| Embedded Array Blocks (EAB) | 20 (2 Kbit each) | — |
| Package | 599-BPGA / HIPGA-599 (Ceramic Pin Grid Array) | PGA-599 |
| Pin Count | 599 | — |
| Operating Temperature | 0C to +70C (Commercial) | –40 °C to +85 °C (Industrial) |
| Mounting Type | Through-Hole (PGA) | Through-Hole (PGA) |
| Configuration | SRAM (volatile), serial/parallel EPROM | — |
| Process Node | 0.42 µm CMOS | — |
| I/O Standard Support | 5.0 V PCI, LVTTL, LVCMOS | — |
| Programming Interface | JTAG (IEEE 1149.1), passive serial | — |
| MSL Level | [DATA_NEEDED: moisture sensitivity level] | [DATA_NEEDED: MSL level] |
| RoHS Status | unknown (ceramic HIPGA package historically non-RoHS) | Non-RoHS Compliant |
| Family | — | FLEX 10K Embedded Programmable Logic Device |
| Logic Elements (LEs) | — | 12,160 |
| Typical Gates | — | 250,000 |
| Maximum User I/O | — | 488 |
| Embedded Array Blocks (EABs) | — | 20 |
| Total RAM Bits | — | 40,960 |
| Core Voltage | — | 2.5 V |
| Supply Voltage Range | — | 2.3 V min |
| Speed Grade | — | –3 |
| Process Technology | — | 0.25 µm CMOS, SRAM-based |
| Configuration Mode | — | Passive Serial, Active Serial, JTAG |