EPF10K250EGC599-2 vs EPF10K250EGC599-1 Comparison

Detailed side-by-side comparison of EPF10K250EGC599-2 by Intel and EPF10K250EGC599-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K250EGC599-2 EPF10K250EGC599-1
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status NRND NRND
Family FLEX 10KE —
Logic Elements 12,160 LEs 40,960
Typical Gates 250,000 —
Maximum User I/O Pins 470 —
Embedded Array Blocks (EABs) 12 —
Total RAM Bits 24,576 bits —
Number of PLLs 4 —
Speed Grade -2 —
Operating Temperature Grade Commercial —
Core Voltage 5 V —
Package 599-BCPGA (CPGA-599 / HIPGA-599) 599-BPGA / HIPGA-599 (Ceramic Pin Grid Array)
Mounting Type Through-Hole (Pin Grid Array) Through-Hole (PGA)
Configuration Method SRAM / EPROM —
JTAG Support IEEE 1149.1 Boundary Scan —
RoHS Status Unknown (legacy ceramic PGA) unknown (ceramic HIPGA package historically non-RoHS)
Lifecycle Status Not Recommended for New Designs (NRND) —
Product Type — FPGA (Field-Programmable Gate Array)
Series — FLEX 10K
Equivalent Gates — 250,000
Flip-Flops — 12,160
User I/O Pins — 470
Embedded Array Blocks (EAB) — 20 (2 Kbit each)
Pin Count — 599
Operating Temperature — 0C to +70C (Commercial)
Configuration — SRAM (volatile), serial/parallel EPROM
Process Node — 0.42 µm CMOS
I/O Standard Support — 5.0 V PCI, LVTTL, LVCMOS
Programming Interface — JTAG (IEEE 1149.1), passive serial
MSL Level — [DATA_NEEDED: moisture sensitivity level]

Datasheets & Resources

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