EPF10K250EGC599-2 vs EPF10K250EGC599-1 Vergleich
Detaillierter Direktvergleich von EPF10K250EGC599-2 von Intel und EPF10K250EGC599-1 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPF10K250EGC599-2 | EPF10K250EGC599-1 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $195,00 | $162,00 |
| Family | FLEX 10KE | — |
| Logic Elements | 12,160 LEs | 40,960 |
| Typical Gates | 250,000 | — |
| Maximum User I/O Pins | 470 | — |
| Embedded Array Blocks (EABs) | 12 | — |
| Total RAM Bits | 24,576 bits | — |
| Number of PLLs | 4 | — |
| Speed Grade | -2 | — |
| Operating Temperature Grade | Commercial | — |
| Core Voltage | 5 V | — |
| Gehäuse | 599-BCPGA (CPGA-599 / HIPGA-599) | 599-BPGA / HIPGA-599 (Ceramic Pin Grid Array) |
| Montageart | Through-Hole (Pin Grid Array) | Through-Hole (PGA) |
| Configuration Method | SRAM / EPROM | — |
| JTAG Support | IEEE 1149.1 Boundary Scan | — |
| RoHS-Status | Unknown (legacy ceramic PGA) | unknown (ceramic HIPGA package historically non-RoHS) |
| Lebenszyklusstatus | Not Recommended for New Designs (NRND) | — |
| Product Type | — | FPGA (Field-Programmable Gate Array) |
| Series | — | FLEX 10K |
| Equivalent Gates | — | 250,000 |
| Flip-Flops | — | 12,160 |
| User I/O Pins | — | 470 |
| Embedded Array Blocks (EAB) | — | 20 (2 Kbit each) |
| Pin-Anzahl | — | 599 |
| Betriebstemperatur | — | 0C to +70C (Commercial) |
| Configuration | — | SRAM (volatile), serial/parallel EPROM |
| Process Node | — | 0.42 µm CMOS |
| I/O Standard Support | — | 5.0 V PCI, LVTTL, LVCMOS |
| Programming Interface | — | JTAG (IEEE 1149.1), passive serial |
| MSL-Level | — | [DATA_NEEDED: moisture sensitivity level] |