EPF10K250EGC599-2 vs EPF10K250EGI599-3 Comparison
Detailed side-by-side comparison of EPF10K250EGC599-2 by Intel and EPF10K250EGI599-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K250EGC599-2 | EPF10K250EGI599-3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | NRND | NRND |
| Family | FLEX 10KE | FLEX 10K Embedded Programmable Logic Device |
| Logic Elements | 12,160 LEs | — |
| Typical Gates | 250,000 | 250,000 |
| Maximum User I/O Pins | 470 | — |
| Embedded Array Blocks (EABs) | 12 | 20 |
| Total RAM Bits | 24,576 bits | 40,960 |
| Number of PLLs | 4 | — |
| Speed Grade | -2 | –3 |
| Operating Temperature Grade | Commercial | — |
| Core Voltage | 5 V | 2.5 V |
| Package | 599-BCPGA (CPGA-599 / HIPGA-599) | PGA-599 |
| Mounting Type | Through-Hole (Pin Grid Array) | Through-Hole (PGA) |
| Configuration Method | SRAM / EPROM | — |
| JTAG Support | IEEE 1149.1 Boundary Scan | — |
| RoHS Status | Unknown (legacy ceramic PGA) | Non-RoHS Compliant |
| Lifecycle Status | Not Recommended for New Designs (NRND) | — |
| Series | — | FLEX 10KE |
| Logic Elements (LEs) | — | 12,160 |
| Maximum User I/O | — | 488 |
| Supply Voltage Range | — | 2.3 V min |
| Operating Temperature | — | –40 °C to +85 °C (Industrial) |
| Process Technology | — | 0.25 µm CMOS, SRAM-based |
| Configuration Mode | — | Passive Serial, Active Serial, JTAG |
| MSL Level | — | [DATA_NEEDED: MSL level] |