EPF10K250EGC599-2 vs EPF10K250EGI599-3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K250EGC599-2 sa pamamagitan ng Intel at EPF10K250EGI599-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF10K250EGC599-2 | EPF10K250EGI599-3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | FLEX 10KE | FLEX 10K Embedded Programmable Logic Device |
| Logic Elements | 12,160 LEs | — |
| Typical Gates | 250,000 | 250,000 |
| Maximum User I/O Pins | 470 | — |
| Embedded Array Blocks (EABs) | 12 | 20 |
| Total RAM Bits | 24,576 bits | 40,960 |
| Number of PLLs | 4 | — |
| Speed Grade | -2 | –3 |
| Operating Temperature Grade | Commercial | — |
| Core Voltage | 5 V | 2.5 V |
| Packhaging | 599-BCPGA (CPGA-599 / HIPGA-599) | PGA-599 |
| Uri ng Pagpapasok | Through-Hole (Pin Grid Array) | Through-Hole (PGA) |
| Configuration Method | SRAM / EPROM | — |
| JTAG Support | IEEE 1149.1 Boundary Scan | — |
| Tindminan RoHS | Unknown (legacy ceramic PGA) | Non-RoHS Compliant |
| Katayuan ng Lifecycle | Not Recommended for New Designs (NRND) | — |
| Series | — | FLEX 10KE |
| Logic Elements (LEs) | — | 12,160 |
| Maximum User I/O | — | 488 |
| Supply Voltage Range | — | 2.3 V min |
| Temperature na Operasyon | — | –40 °C to +85 °C (Industrial) |
| Process Technology | — | 0.25 µm CMOS, SRAM-based |
| Configuration Mode | — | Passive Serial, Active Serial, JTAG |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |