EPF10K30EFC256-1X vs EPF10K30EFC256-1 Comparison

Detailed side-by-side comparison of EPF10K30EFC256-1X by Intel and EPF10K30EFC256-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K30EFC256-1X EPF10K30EFC256-1
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $95.60 $69.50
Family FLEX 10KE FLEX 10KE
Logic Elements 1728 β€”
Typical Gates 30,000 30,000
Logic Array Blocks (LABs) 216 β€”
Embedded Memory (EAB RAM) 24,576 bits (6 EABs of 4 Kbit each) β€”
User I/O 176 β€”
Maximum Internal Frequency 250 MHz β€”
Propagation Delay (tpd) 0.4 ns to 0.6 ns β€”
Process Technology 0.22 Β΅m CMOS 0.22 Β΅m CMOS SRAM
Core Supply Voltage 2.5 V β€”
MultiVolt I/O Support 2.5 V / 3.3 V / 5 V β€”
Package 256-ball FBGA, 17 x 17 mm, 1.0 mm pitch (FineLine BGA) β€”
Speed Grade -1X (fastest commercial) -1
Operating Temperature 0 Β°C to +70 Β°C (commercial) 0C to +70C (Commercial)
Configuration Method SRAM, JTAG (IEEE 1149.1) β€”
Phase-Locked Loops 4 β€”
Compliance RoHS (check distributor for specific lot), Pb-free option available β€”
Series β€” FLEX 10KE
Logic Elements / Cells β€” 1,728
Total RAM Bits β€” 24,576
Number of I/O β€” 176
Number of Logic Gates β€” 119,000
Voltage - Supply β€” 2.375 V to 2.625 V
Mounting Type β€” Surface Mount
Package / Case β€” 256-FBGA (17 x 17 mm, 1 mm pitch)
Supplier Device Package β€” 256-FBGA
RoHS Status β€” Compliant (verify per lot)

Datasheets & Resources

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