EPF10K30EFC256-1X vs EPF10K30EFC256-1 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K30EFC256-1X disebabkan oleh Intel dan EPF10K30EFC256-1 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EPF10K30EFC256-1X - FLEX 10KE FPGA, 30K Gates, 256-BGA | Intel / Altera
EPF10K30EFC256-1X ObsoletePengandingan Spesifikasi
| Parametr | EPF10K30EFC256-1X | EPF10K30EFC256-1 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements | 1728 | — |
| Typical Gates | 30,000 | 30,000 |
| Logic Array Blocks (LABs) | 216 | — |
| Embedded Memory (EAB RAM) | 24,576 bits (6 EABs of 4 Kbit each) | — |
| User I/O | 176 | — |
| Maximum Internal Frequency | 250 MHz | — |
| Propagation Delay (tpd) | 0.4 ns to 0.6 ns | — |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS SRAM |
| Core Supply Voltage | 2.5 V | — |
| MultiVolt I/O Support | 2.5 V / 3.3 V / 5 V | — |
| Kemasan | 256-ball FBGA, 17 x 17 mm, 1.0 mm pitch (FineLine BGA) | — |
| Speed Grade | -1X (fastest commercial) | -1 |
| Suhu Operasi | 0 °C to +70 °C (commercial) | 0C to +70C (Commercial) |
| Configuration Method | SRAM, JTAG (IEEE 1149.1) | — |
| Phase-Locked Loops | 4 | — |
| Compliance | RoHS (check distributor for specific lot), Pb-free option available | — |
| Series | — | FLEX 10KE |
| Logic Elements / Cells | — | 1,728 |
| Total RAM Bits | — | 24,576 |
| Number of I/O | — | 176 |
| Number of Logic Gates | — | 119,000 |
| Voltage - Supply | — | 2.375 V to 2.625 V |
| Jenis Pemasangan | — | Surface Mount |
| Kemasan / Case | — | 256-FBGA (17 x 17 mm, 1 mm pitch) |
| Supplier Device Package | — | 256-FBGA |
| Status RoHS | — | Compliant (verify per lot) |