EPF10K30EFC256-1X vs EPF10K30EFC256-2 Comparison
Detailed side-by-side comparison of EPF10K30EFC256-1X by Intel and EPF10K30EFC256-2 by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF10K30EFC256-1X - FLEX 10KE FPGA, 30K Gates, 256-BGA | Intel / Altera
EPF10K30EFC256-1X ObsoleteSpecification Comparison
| Parameter | EPF10K30EFC256-1X | EPF10K30EFC256-2 |
|---|---|---|
| Brand | Intel | Altera |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements | 1728 | — |
| Typical Gates | 30,000 | — |
| Logic Array Blocks (LABs) | 216 | 216 |
| Embedded Memory (EAB RAM) | 24,576 bits (6 EABs of 4 Kbit each) | — |
| User I/O | 176 | — |
| Maximum Internal Frequency | 250 MHz | — |
| Propagation Delay (tpd) | 0.4 ns to 0.6 ns | — |
| Process Technology | 0.22 µm CMOS | — |
| Core Supply Voltage | 2.5 V | 2.375 V to 2.625 V (typ 2.5 V) |
| MultiVolt I/O Support | 2.5 V / 3.3 V / 5 V | — |
| Package | 256-ball FBGA, 17 x 17 mm, 1.0 mm pitch (FineLine BGA) | 256-FBGA (17x17 mm) |
| Speed Grade | -1X (fastest commercial) | -2 (commercial, mid-speed) |
| Operating Temperature | 0 °C to +70 °C (commercial) | 0 C to 70 C (commercial) |
| Configuration Method | SRAM, JTAG (IEEE 1149.1) | SRAM, JTAG (IEEE 1149.1), Passive Serial |
| Phase-Locked Loops | 4 | — |
| Compliance | RoHS (check distributor for specific lot), Pb-free option available | — |
| Logic Elements / Cells | — | 1728 |
| System Gates | — | 30,000 |
| Embedded RAM Bits | — | 24,576 |
| User I/Os | — | 176 |
| Internal Operating Frequency | — | 80 MHz |
| Propagation Delay | — | 0.6 ns |
| Technology Node | — | 0.22 um CMOS |
| RoHS Status | — | [DATA_NEEDED: rohs status] |
| MSL Level | — | [DATA_NEEDED: MSL moisture sensitivity level] |