EPF10K30EFC256-2X vs EPF10K30EFC256-2N Comparison

Detailed side-by-side comparison of EPF10K30EFC256-2X by Altera and EPF10K30EFC256-2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K30EFC256-2X EPF10K30EFC256-2N
Brand Altera Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Series FLEX-10KE FLEX 10KE
Family FLEX 10KE FLEX 10KE Embedded Programmable Logic Family
Gates 30,000 —
Logic Elements / Cells 1,728 —
Number of LABs/CLBs 216 —
Number of Logic Elements/Cells 1,728 —
Total RAM Bits 24,576 —
Number of I/O 176 —
Voltage - Supply 2.375 V to 2.625 V —
Operating Temperature 0°C to 70°C 0 °C to +70 °C (Commercial)
Internal Frequency (Max) 200 MHz —
Propagation Delay 0.6 ns 0.6 ns (per digchip listing; internal frequency 80 MHz)
Technology 0.22 µm CMOS —
Supplier Device Package 256-FBGA (17x17) —
Package / Case 256-BGA —
Mounting Type Surface Mount Surface Mount
Speed Grade -2 -2N (mid-grade, 0.6 ns)
RoHS Status [DATA_NEEDED: RoHS status] —
Typical Gates — 30,000
Logic Elements (LEs) — 1,728
Embedded RAM Bits — 24,576
Embedded Array Blocks (EABs) — 6
User I/Os — 246
Logic Cells — 1728
Number of Logic Elements — 24576
Supply Voltage — [DATA_NEEDED: core and I/O rail voltages]
Process Technology — 0.22 µm CMOS, SRAM-based
Package — 256-ball FineLine BGA (PBGA256), 17 x 17 mm, 1.0 mm pitch
Configuration — Passive Serial / Active Serial / JTAG
Lead Free / RoHS — Non-RoHS (legacy, SnPb finish per FBGA-256 family)

Datasheets & Resources

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