EPF10K30EFC256-2X vs EPF10K30EFC256-2N Comparación
Comparación detallada lado a lado de EPF10K30EFC256-2X por Altera y EPF10K30EFC256-2N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Altera
EPF10K30EFC256-2X - 30K FLEX-10KE FPGA 1728 Cells 256-BGA | Intel / Altera
EPF10K30EFC256-2X ObsoleteIntel
EPF10K30EFC256-2N - FLEX 10KE FPGA 30K Gates 256-BGA | Intel / Altera
EPF10K30EFC256-2N ObsoleteComparación de especificaciones
| Parámetro | EPF10K30EFC256-2X | EPF10K30EFC256-2N |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $17,95 | $48,57 |
| Series | FLEX-10KE | FLEX 10KE |
| Family | FLEX 10KE | FLEX 10KE Embedded Programmable Logic Family |
| Gates | 30,000 | — |
| Logic Elements / Cells | 1,728 | — |
| Number of LABs/CLBs | 216 | — |
| Number of Logic Elements/Cells | 1,728 | — |
| Total RAM Bits | 24,576 | — |
| Number of I/O | 176 | — |
| Voltage - Supply | 2.375 V to 2.625 V | — |
| Temperatura de funcionamiento | 0°C to 70°C | 0 °C to +70 °C (Commercial) |
| Internal Frequency (Max) | 200 MHz | — |
| Propagation Delay | 0.6 ns | 0.6 ns (per digchip listing; internal frequency 80 MHz) |
| Technology | 0.22 µm CMOS | — |
| Supplier Device Package | 256-FBGA (17x17) | — |
| Encapsulado / Carcasa | 256-BGA | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Speed Grade | -2 | -2N (mid-grade, 0.6 ns) |
| Estado RoHS | [DATA_NEEDED: RoHS status] | — |
| Typical Gates | — | 30,000 |
| Logic Elements (LEs) | — | 1,728 |
| Embedded RAM Bits | — | 24,576 |
| Embedded Array Blocks (EABs) | — | 6 |
| User I/Os | — | 246 |
| Logic Cells | — | 1728 |
| Number of Logic Elements | — | 24576 |
| Tensión de alimentación | — | [DATA_NEEDED: core and I/O rail voltages] |
| Process Technology | — | 0.22 µm CMOS, SRAM-based |
| Encapsulado | — | 256-ball FineLine BGA (PBGA256), 17 x 17 mm, 1.0 mm pitch |
| Configuration | — | Passive Serial / Active Serial / JTAG |
| Lead Free / RoHS | — | Non-RoHS (legacy, SnPb finish per FBGA-256 family) |