EPF10K30EFC256-3 vs EPF6016AFC256-3 Comparison

Detailed side-by-side comparison of EPF10K30EFC256-3 by Intel and EPF6016AFC256-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K30EFC256-3 EPF6016AFC256-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Family FLEX 10KE FLEX 6000
Typical Gates 30,000 —
Logic Elements / Cells 1,728 —
Logic Array Blocks (LABs) 216 132
Embedded RAM Bits 24,576 —
User I/O Pins 176 —
Maximum Operating Frequency 200 MHz —
Process Technology 0.22 micrometer CMOS 0.42 µm CMOS
Core Supply Voltage (VCCINT) 2.5 V —
I/O Supply Voltage (VCCIO) 3.3 V (multi-voltage I/O standard support) —
Package 256-ball FineLine BGA 256-ball FineLine BGA (FBGA)
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
Speed Grade -3 (fastest) -3
Temperature Grade Commercial —
Configuration Interface Serial (EPC8/EPC16) and JTAG (IEEE 1149.1) —
RoHS Status [DATA_NEEDED: RoHS status] —
Device Type — FPGA (Field Programmable Gate Array)
Equivalent Gates — 16K
Logic Elements (LEs) — 1320
User I/Os — 171
Maximum Internal Frequency — 142.86 MHz
Edge Rate — 172 MHz
Core Supply Voltage — 3.3 V
Pin Count — 256
Configuration Method — SRAM (volatile, requires external PROM)
Programming Interface — JTAG (IEEE 1149.1)
Operating Temperature — 0 °C to +85 °C (commercial)

Datasheets & Resources

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