EPF10K30EQC208-3N vs EPF10K30EQC208-1 Comparison
Detailed side-by-side comparison of EPF10K30EQC208-3N by Intel and EPF10K30EQC208-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF10K30EQC208-3N - 30K Gates FLEX 10KE FPGA, 208-PQFP | Intel
EPF10K30EQC208-3N ⚠ Last Time Buy
Specification Comparison
| Parameter | EPF10K30EQC208-3N | EPF10K30EQC208-1 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last Time Buy | Obsolete |
| Family | FLEX 10KE | FLEX 10K |
| Logic Elements / Cells | 1,728 | 1,728 |
| Typical Gates | 30,000 | — |
| Total RAM Bits | 24,576 | 24,576 |
| Logic Array Blocks (LABs) | 216 | 216 |
| User I/Os | 147 | 147 |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Internal Frequency | 200 MHz | 80 MHz (max) |
| Propagation Delay | 0.6 ns (typical) | 0.6 ns (typ) |
| Core Voltage | 2.5 V | 2.5 V (2.375 V–2.625 V) |
| Process Technology | 0.22 µm CMOS | 0.30 µm CMOS SRAM |
| Operating Temperature | 0 °C to +70 °C (commercial) | 0 °C to +70 °C (Commercial) |
| Package | 208-pin PQFP (BFQFP, plastic) | 208-BQFP (PQFP) 28×28 mm |
| Mounting Type | Surface Mount | Surface Mount (Gull-Wing) |
| Configuration Memory | SRAM (volatile, requires external PROM) | — |
| JTAG Support | IEEE 1149.1 boundary-scan | — |
| Lead-Free / RoHS | Lead-free per package marking; RoHS compliance [DATA_NEEDED] | — |
| Series | — | FLEX 10KE |
| Total Gates | — | 30,000 (typical), 119,000 (maximum) |
| Embedded Array Blocks (EABs) | — | 6 (2,048 bits each) |
| I/O Voltage | — | 5.0 V tolerant |
| Configuration Interface | — | JTAG (IEEE 1149.1) + Serial (EPC compatible) |
| RoHS Status | — | Not RoHS compliant (SnPb lead finish on BQFP) |