EPF10K30EQC208-3N vs EPF10K30EQC208-1 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K30EQC208-3N disebabkan oleh Intel dan EPF10K30EQC208-1 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EPF10K30EQC208-3N - 30K Gates FLEX 10KE FPGA, 208-PQFP | Intel
EPF10K30EQC208-3N ⚠ Bahagian terakhir untuk beli
Pengandingan Spesifikasi
| Parametr | EPF10K30EQC208-3N | EPF10K30EQC208-1 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Obsolete |
| Family | FLEX 10KE | FLEX 10K |
| Logic Elements / Cells | 1,728 | 1,728 |
| Typical Gates | 30,000 | — |
| Total RAM Bits | 24,576 | 24,576 |
| Logic Array Blocks (LABs) | 216 | 216 |
| User I/Os | 147 | 147 |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Internal Frequency | 200 MHz | 80 MHz (max) |
| Propagation Delay | 0.6 ns (typical) | 0.6 ns (typ) |
| Core Voltage | 2.5 V | 2.5 V (2.375 V–2.625 V) |
| Process Technology | 0.22 µm CMOS | 0.30 µm CMOS SRAM |
| Suhu Operasi | 0 °C to +70 °C (commercial) | 0 °C to +70 °C (Commercial) |
| Kemasan | 208-pin PQFP (BFQFP, plastic) | 208-BQFP (PQFP) 28×28 mm |
| Jenis Pemasangan | Surface Mount | Surface Mount (Gull-Wing) |
| Configuration Memory | SRAM (volatile, requires external PROM) | — |
| JTAG Support | IEEE 1149.1 boundary-scan | — |
| Lead-Free / RoHS | Lead-free per package marking; RoHS compliance [DATA_NEEDED] | — |
| Series | — | FLEX 10KE |
| Total Gates | — | 30,000 (typical), 119,000 (maximum) |
| Embedded Array Blocks (EABs) | — | 6 (2,048 bits each) |
| I/O Voltage | — | 5.0 V tolerant |
| Configuration Interface | — | JTAG (IEEE 1149.1) + Serial (EPC compatible) |
| Status RoHS | — | Not RoHS compliant (SnPb lead finish on BQFP) |