EPF10K30EQI208-2 vs EPF10K30EQC208-3N Comparison

Detailed side-by-side comparison of EPF10K30EQI208-2 by Intel and EPF10K30EQC208-3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EPF10K30EQC208-3N EPF10K30EQC208-3N - 30K Gates FLEX 10KE FPGA, 208-PQFP | Intel

EPF10K30EQC208-3N - 30K Gates FLEX 10KE FPGA, 208-PQFP | Intel

EPF10K30EQC208-3N ⚠ Last Time Buy

Specification Comparison

Parameter EPF10K30EQI208-2 EPF10K30EQC208-3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Last Time Buy
Family FLEX 10KE FLEX 10KE
Logic Elements 1,728 —
Logic Array Blocks (LABs) 216 216
Typical Gates 30,000 30,000
Maximum System Gates 119,000 —
Embedded Memory (RAM bits) 24,576 —
User I/Os 147 147
Package 208-PQFP (BFQFP) 208-pin PQFP (BFQFP, plastic)
Pin Count 208 —
Core Voltage (VCCINT) 2.375 V to 2.625 V —
Operating Temperature -40 °C to +85 °C (Industrial) 0 °C to +70 °C (commercial)
Process Technology 0.42 µm CMOS SRAM 0.22 µm CMOS
Configuration Method Passive Serial (with EPC2/EPC8) —
Mounting Type Surface Mount Surface Mount
RoHS Status unknown —
Logic Elements / Cells — 1,728
Total RAM Bits — 24,576
Number of I/O Banks — [DATA_NEEDED: number of I/O banks]
Internal Frequency — 200 MHz
Propagation Delay — 0.6 ns (typical)
Core Voltage — 2.5 V
Configuration Memory — SRAM (volatile, requires external PROM)
JTAG Support — IEEE 1149.1 boundary-scan
Lead-Free / RoHS — Lead-free per package marking; RoHS compliance [DATA_NEEDED]

Datasheets & Resources

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