EPF10K50VBI356-3N vs EPF10K50VBI356-4 Comparison

Detailed side-by-side comparison of EPF10K50VBI356-3N by Intel and EPF10K50VBI356-4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EPF10K50VBI356-3N EPF10K50VBI356-3N - 50K Gates, 356-BGA FLEX 10K FPGA | Altera

EPF10K50VBI356-3N - 50K Gates, 356-BGA FLEX 10K FPGA | Altera

EPF10K50VBI356-3N ⚠ Last Time Buy

Specification Comparison

Parameter EPF10K50VBI356-3N EPF10K50VBI356-4
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last Time Buy Obsolete
Family FLEX 10K FLEX 10K
Series FLEX-10K® —
Logic Elements / Cells 2880 2,880
Total RAM Bits 20480 —
Number of LABs/CLBs 360 —
Number of User I/O 274 —
Number of Gates (typical) 50000 —
Process Technology 0.42 µm CMOS SRAM 0.42 µm CMOS
Core Supply Voltage 3.3 V 3.3 V
Operating Temperature (industrial) -40 °C to +85 °C —
Speed Grade -3 (commercial/industrial timing) -4
Package Type 356-LBGA (Ball Grid Array, low-profile) —
Mounting Type Surface Mount Surface Mount (BGA)
In-System Programmable Yes (JTAG IEEE 1149.1) —
Lead-Free (Pb-Free) Yes (suffix "N") —
Typical Gates — 50,000
Usable Gates — 20,480
Logic Array Blocks (LABs) — 360
Embedded Array Blocks (EABs) — 16
Maximum User I/O — 274
Internal Frequency — 125 MHz
Propagation Delay — 0.6 ns
Package — 356-ball LBGA
Operating Temperature — 0 °C to 70 °C (Commercial)
Configuration Method — SRAM, in-system via JTAG

Datasheets & Resources

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