EPF10K50VRC240-3N vs EPF10K50VRC240-2 Comparison
Detailed side-by-side comparison of EPF10K50VRC240-3N by Intel and EPF10K50VRC240-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K50VRC240-3N | EPF10K50VRC240-2 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | NRND | NRND |
| Series | FLEX 10K | — |
| Family | FLEX 10K (Altera / Intel) | Flex 10K |
| Typical Gates | 50,000 | 50,000 |
| Logic Cells / Logic Elements | 2,880 | — |
| Logic Array Blocks (LABs) | 360 | 360 |
| Embedded Array Bits | 20,480 bits (EABs) | — |
| Maximum User I/O | 189 | — |
| Core Voltage | 3.3 V | — |
| Internal Frequency (max) | 125 MHz | — |
| Propagation Delay | 0.6 ns (per digchip datasheet snippet) | 0.6 ns |
| Process Technology | 0.42 µm CMOS, SRAM-based | 0.42 µm CMOS |
| Package | 240-RQFP (RQFP / Power QFP) with exposed pad | 240-pin RQFP / HFQFP (exposed pad), gull-wing |
| Operating Temperature | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (commercial) |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | [DATA_NEEDED: confirm against manufacturer declaration] | [DATA_NEEDED: RoHS compliance] |
| Configuration Method | SRAM, in-system programmable via JTAG / serial PROM | — |
| Speed Grade | -3 | -2 (mid) |
| Logic Cells | — | 2,880 |
| Logic Elements (LEs) | — | 20,480 |
| User I/Os | — | 189 |
| Embedded Array Blocks (EABs) | — | [DATA_NEEDED: EAB count and RAM bits] |
| Maximum Internal Frequency | — | 125 MHz |
| Core Supply Voltage | — | 3.3 V |
| Configuration Memory | — | SRAM (volatile, external PROM required) |