EPF10K50VRC240-3N vs EPF10K50VRC240-2 Comparación
Comparación detallada lado a lado de EPF10K50VRC240-3N por Intel y EPF10K50VRC240-2 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF10K50VRC240-3N | EPF10K50VRC240-2 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $58,75 | $18,95 |
| Series | FLEX 10K | — |
| Family | FLEX 10K (Altera / Intel) | Flex 10K |
| Typical Gates | 50,000 | 50,000 |
| Logic Cells / Logic Elements | 2,880 | — |
| Logic Array Blocks (LABs) | 360 | 360 |
| Embedded Array Bits | 20,480 bits (EABs) | — |
| Maximum User I/O | 189 | — |
| Core Voltage | 3.3 V | — |
| Internal Frequency (max) | 125 MHz | — |
| Propagation Delay | 0.6 ns (per digchip datasheet snippet) | 0.6 ns |
| Process Technology | 0.42 µm CMOS, SRAM-based | 0.42 µm CMOS |
| Encapsulado | 240-RQFP (RQFP / Power QFP) with exposed pad | 240-pin RQFP / HFQFP (exposed pad), gull-wing |
| Temperatura de funcionamiento | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (commercial) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | [DATA_NEEDED: confirm against manufacturer declaration] | [DATA_NEEDED: RoHS compliance] |
| Configuration Method | SRAM, in-system programmable via JTAG / serial PROM | — |
| Speed Grade | -3 | -2 (mid) |
| Logic Cells | — | 2,880 |
| Logic Elements (LEs) | — | 20,480 |
| User I/Os | — | 189 |
| Embedded Array Blocks (EABs) | — | [DATA_NEEDED: EAB count and RAM bits] |
| Maximum Internal Frequency | — | 125 MHz |
| Core Supply Voltage | — | 3.3 V |
| Configuration Memory | — | SRAM (volatile, external PROM required) |