EPF10K70RC240-2 vs EPF10K70RC240-3N Comparison

Detailed side-by-side comparison of EPF10K70RC240-2 by Intel and EPF10K70RC240-3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K70RC240-2 EPF10K70RC240-3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status NRND Obsolete
Family FLEX 10K FLEX 10K
Logic Elements / Cells 3,744 —
Total Gates 70,000 (typical) —
Number of LABs/CLBs 468 —
Number of Flip-Flops 18,432 —
Embedded Array Blocks (EABs) 9 [DATA_NEEDED: exact EAB count]
Maximum User I/O 189 —
Number of I/O Banks [DATA_NEEDED: I/O bank count] —
Operating Supply Voltage 5 V —
Process Technology 0.42 µm CMOS 0.42 µm CMOS SRAM
Maximum Internal Frequency 125 MHz 125 MHz
Speed Grade -2 -3 (0.5 ns typical propagation delay)
Operating Temperature 0°C to +70°C (commercial) Commercial (0C to +70C)
Package 240-BFQFP Exposed Pad (RQFP, gull-wing) 240-pin RQFP (BFQFP with exposed pad)
Mounting Type Surface Mount Surface Mount
Programmability SRAM-based, in-system programmable —
Configuration Interface Serial configuration EPROM, JTAG (IEEE 1149.1) —
RoHS Status unknown [DATA_NEEDED: confirm RoHS - FLEX 10K predates RoHS directive]
Logic Elements (LEs) — 3,744
Equivalent Gates — 70,000
Total RAM Bits — 18,432
User I/Os — 189
Logic Array Blocks (LABs) — 468
Supply Voltage (VCCINT/VCCIO) — 5.0 V
Configuration Method — Passive serial / Passive parallel / JTAG
I/O Standards Supported — 5.0 V tolerant, 3.3 V, 2.5 V (MultiVolt)
JTAG Support — IEEE 1149.1 boundary-scan compliant
PCI Compliance — PCI SIG Local Bus Specification Revision 2.2
Lead-Free / Pb-Free Finish — Yes (N suffix)

Datasheets & Resources

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