EPF6010ANTC100-3 vs EPF6010ANTC100-2 Comparison

Detailed side-by-side comparison of EPF6010ANTC100-3 by Intel and EPF6010ANTC100-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EPF6010ANTC100-3 EPF6010ANTC100-3 - FLEX 6000 FPGA 880 LE 71 I/O 100-TQFP | Intel

EPF6010ANTC100-3 - FLEX 6000 FPGA 880 LE 71 I/O 100-TQFP | Intel

EPF6010ANTC100-3 ⚠ Last Time Buy

Specification Comparison

Parameter EPF6010ANTC100-3 EPF6010ANTC100-2
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last Time Buy Last Time Buy
Family FLEX 6000 FLEX 6000 / FLEX 6000A
Logic Elements 880 LE 880
User I/O Count 71 —
Embedded Memory 16000 bit [DATA_NEEDED: embedded RAM blocks]
Number of Logic Array Blocks (LABs) 8 —
Package 100-TQFP 100-pin TQFP (14x14 mm, 0.5 mm pitch)
Speed Grade -3 -2
Core Voltage 5 V —
Process Technology 0.42 µm CMOS SRAM —
Configuration Interface JTAG (IEEE 1149.1) / Serial / Parallel —
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
Mounting Type Surface Mount Surface Mount
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance]
I/O Standards Supported LVTTL, LVCMOS, PCI (MultiVolt I/O) TTL, CMOS, PCI (with clamping diodes)
Programmable Interconnect Continuous FastTrack —
Programmable I/O Pins — 71
Operating Temperature — Commercial (0C to +70C)
Configuration Method — SRAM (volatile), in-system programmable
Programming Interface — IEEE 1149.1 (JTAG) / passive serial / EPC configuration device
Supply Voltage (VCCINT) — 5.0 V (FLEX 6000A); 3.3 V (FLEX 6000)
Number of LABs — [DATA_NEEDED: LAB count]
Global Clock Networks — [DATA_NEEDED: global clock count]
MSL Level — 3 (168 hours)
Packaging — Tray (per Altera packing standard)

Datasheets & Resources

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