EPF6016AFC256-3 vs EPF6024AFC256-3 Comparison
Detailed side-by-side comparison of EPF6016AFC256-3 by Intel and EPF6024AFC256-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF6024AFC256-3 - 24K Gates 1960 Cells FLEX 6000 FPGA | Intel | BGA-256
EPF6024AFC256-3 ObsoleteSpecification Comparison
| Parameter | EPF6016AFC256-3 | EPF6024AFC256-3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Family | FLEX 6000 | FLEX 6000 |
| Device Type | FPGA (Field Programmable Gate Array) | FPGA (Field Programmable Gate Array) / SPLD classification in some catalogs |
| Equivalent Gates | 16K | — |
| Logic Elements (LEs) | 1320 | — |
| Logic Array Blocks (LABs) | 132 | — |
| User I/Os | 171 | 218 |
| Maximum Internal Frequency | 142.86 MHz | 172 MHz |
| Edge Rate | 172 MHz | — |
| Process Technology | 0.42 µm CMOS | 0.42 umm CMOS |
| Core Supply Voltage | 3.3 V | — |
| Package | 256-ball FineLine BGA (FBGA) | 256-ball FBGA (FineLine BGA) |
| Pin Count | 256 | — |
| Speed Grade | -3 | -3 (fastest of three FLEX 6000 commercial grades) |
| Configuration Method | SRAM (volatile, requires external PROM) | SRAM, serial/parallel via MAX+PLUS II or Quartus |
| Programming Interface | JTAG (IEEE 1149.1) | — |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0C to +85C (commercial) |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Logic Elements / Cells | — | 1960 |
| Total Gates | — | 24K |
| Maximum Operating Frequency | — | 142.86 MHz |
| Supply Voltage | — | 3.3 V |
| Pins / Balls | — | 256 |
| RoHS Status | — | unknown |
| Lead-Free | — | unknown |
| Supplier Package Code | — | BGA-256 / FBGA-256 |