EPF6016AFC256-3 vs EPF6024AFC256-3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF6016AFC256-3 sa pamamagitan ng Intel at EPF6024AFC256-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF6024AFC256-3 - 24K Gates 1960 Cells FLEX 6000 FPGA | Intel | BGA-256
EPF6024AFC256-3 ObsoletePagsanggunian na paghahambing
| Parametro | EPF6016AFC256-3 | EPF6024AFC256-3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | FLEX 6000 | FLEX 6000 |
| Device Type | FPGA (Field Programmable Gate Array) | FPGA (Field Programmable Gate Array) / SPLD classification in some catalogs |
| Equivalent Gates | 16K | — |
| Logic Elements (LEs) | 1320 | — |
| Logic Array Blocks (LABs) | 132 | — |
| User I/Os | 171 | 218 |
| Maximum Internal Frequency | 142.86 MHz | 172 MHz |
| Edge Rate | 172 MHz | — |
| Process Technology | 0.42 µm CMOS | 0.42 umm CMOS |
| Core Supply Voltage | 3.3 V | — |
| Packhaging | 256-ball FineLine BGA (FBGA) | 256-ball FBGA (FineLine BGA) |
| Bilang ng Pin | 256 | — |
| Speed Grade | -3 | -3 (fastest of three FLEX 6000 commercial grades) |
| Configuration Method | SRAM (volatile, requires external PROM) | SRAM, serial/parallel via MAX+PLUS II or Quartus |
| Programming Interface | JTAG (IEEE 1149.1) | — |
| Temperature na Operasyon | 0 °C to +85 °C (commercial) | 0C to +85C (commercial) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Logic Elements / Cells | — | 1960 |
| Total Gates | — | 24K |
| Maximum Operating Frequency | — | 142.86 MHz |
| Volte ng Pagbibigay | — | 3.3 V |
| Pins / Balls | — | 256 |
| Tindminan RoHS | — | unknown |
| Lead-Free | — | unknown |
| Supplier Package Code | — | BGA-256 / FBGA-256 |