EPF6016ATC144-3N vs EPF6010ATC144-3N Comparison
Detailed side-by-side comparison of EPF6016ATC144-3N by Intel and EPF6010ATC144-3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF6016ATC144-3N | EPF6010ATC144-3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Family | FLEX 6000 | FLEX 6000 |
| Architecture | OptiFLEX | — |
| Logic Elements | 1,320 | — |
| Logic Array Blocks (LABs) | 132 | — |
| Typical Gate Count | 16,000 gates | — |
| User I/O Pins | 117 | — |
| Maximum Internal Frequency | 142.86 MHz | — |
| Process Technology | 0.42 micron CMOS | 0.42 µm CMOS, SRAM-based |
| Core Supply Voltage | 3.3 V | — |
| Configuration Memory Type | SRAM (volatile) | — |
| Package | TQFP-144 | 144-pin TQFP (20x20 mm, 1.0 mm pitch) |
| Operating Temperature | Commercial (0C to +70C) | 0 °C to 85 °C |
| Speed Grade | -3 | -3 |
| Programming Interface | JTAG (IEEE 1149.1) | JTAG (IEEE 1149.1) + passive serial/parallel |
| Mounting Type | Surface Mount | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | — |
| Logic Elements / Cells | — | 880 |
| Number of Gates | — | 10,000 |
| Number of LABs/CLBs | — | 88 |
| Number of User I/Os | — | 102 |
| Number of Logic Elements/Cells | — | 880 |
| Supply Voltage | — | 3.3 V |
| Internal Performance | — | 200 MHz |
| Configuration Memory | — | SRAM (volatile, requires external PROM) |
| Supplier Device Package | — | 144-TQFP |
| Mounting Style | — | Surface Mount (SMD) |
| Part Status | — | Obsolete (End of Life) |
| Packaging | — | Tray |