EPF6016ATC144-3N vs EPF6010ATC144-3N Comparación
Comparación detallada lado a lado de EPF6016ATC144-3N por Intel y EPF6010ATC144-3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF6016ATC144-3N | EPF6010ATC144-3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $12,40 | $24,60 |
| Family | FLEX 6000 | FLEX 6000 |
| Architecture | OptiFLEX | — |
| Logic Elements | 1,320 | — |
| Logic Array Blocks (LABs) | 132 | — |
| Typical Gate Count | 16,000 gates | — |
| User I/O Pins | 117 | — |
| Maximum Internal Frequency | 142.86 MHz | — |
| Process Technology | 0.42 micron CMOS | 0.42 µm CMOS, SRAM-based |
| Core Supply Voltage | 3.3 V | — |
| Configuration Memory Type | SRAM (volatile) | — |
| Encapsulado | TQFP-144 | 144-pin TQFP (20x20 mm, 1.0 mm pitch) |
| Temperatura de funcionamiento | Commercial (0C to +70C) | 0 °C to 85 °C |
| Speed Grade | -3 | -3 |
| Programming Interface | JTAG (IEEE 1149.1) | JTAG (IEEE 1149.1) + passive serial/parallel |
| Tipo de montaje | Surface Mount | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | — |
| Logic Elements / Cells | — | 880 |
| Number of Gates | — | 10,000 |
| Number of LABs/CLBs | — | 88 |
| Number of User I/Os | — | 102 |
| Number of Logic Elements/Cells | — | 880 |
| Tensión de alimentación | — | 3.3 V |
| Internal Performance | — | 200 MHz |
| Configuration Memory | — | SRAM (volatile, requires external PROM) |
| Supplier Device Package | — | 144-TQFP |
| Estilo de montaje | — | Surface Mount (SMD) |
| Part Status | — | Obsolete (End of Life) |
| Packaging | — | Tray |