EPF6024ATC144-11 vs EPF6016ATC144-3 Comparison

Detailed side-by-side comparison of EPF6024ATC144-11 by Intel and EPF6016ATC144-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF6024ATC144-11 EPF6016ATC144-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Family FLEX 6000 FLEX 6000
Device Logic Elements 1,960 —
Typical Gates 24,000 —
Logic Array Blocks (LABs) 196 132
User I/O Pins 117 —
Speed Grade -11 -3
Package 144-LQFP (LQFP-144, 20x20 mm, 0.5 mm pitch) TQFP-144 (20 x 20 mm)
Configuration Technology SRAM (volatile, requires external configuration device) —
Core Voltage 5 V —
Process Technology 0.42 µm CMOS 0.42 µm CMOS SRAM
Logic Element Structure 4-input LUT with dedicated carry and cascade chains —
Programming Interface JTAG (ByteBlaster / BitBlaster compatible) —
Mounting Type Surface Mount Surface Mount
Operating Temperature (Commercial) [DATA_NEEDED: full commercial/industrial temp range] —
RoHS Status [DATA_NEEDED: lead-free / RoHS compliance status] [DATA_NEEDED: rohs status]
Recommended Configuration Device EPC1, EPC1441 (or compatible serial configuration PROM) —
Device Type — FPGA (Field Programmable Gate Array)
Logic Elements / Cells — 1320
Logic Gates — 16000
User I/Os — 117
Number of Pins — 144
Internal Frequency (max) — 142.86 MHz
Core Voltage (VCCINT) — 3.3 V
I/O Voltage (VCCIO) — 2.5 V / 3.3 V / 5.0 V
Operating Temperature — 0 °C to +85 °C (commercial)
Configuration Method — SRAM, ISP via JTAG or EPC2/EPC4 PROM

Datasheets & Resources

Browse All Products Create BOM Request Quote