EPF8282ALC84-2 vs EPF8282ALI84-4 Comparison

Detailed side-by-side comparison of EPF8282ALC84-2 by Intel and EPF8282ALI84-4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF8282ALC84-2 EPF8282ALI84-4
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Family FLEX 8000 FLEX 8000
Device Logic Elements / FFs 208 —
Usable Gates 2,500 —
Logic Array Blocks (LABs) 26 —
Maximum User I/Os 68 —
Process Technology 0.42 micrometer CMOS, SRAM-based 0.42 µm CMOS SRAM
Package 84-pin LCC (J-Lead), PLCC-84 84-pin PLCC
Core Supply Voltage 5.0 V 5 V
Configuration Method External configuration device (EPC1/EPC1441) or JTAG SRAM (in-circuit reconfigurable)
In-Circuit Reconfigurability Yes (ICR) —
JTAG Support IEEE 1149.1 boundary-scan —
Temperature Grade (this part) Commercial (suffix 'C' in package code) —
Speed Grade -2 -4
RoHS Status Unknown (legacy Altera part, pre-RoHS transition) —
Lead-Free Unknown —
Mounting Type Surface Mount (J-Lead) Through-Hole (PLCC socket)
Usable Gates (typical) — 2,500
Usable Gates (family max) — 16,000
Logic Elements / Cells — 208
Maximum Operating Frequency — 125 MHz
JTAG Boundary Scan — Yes (IEEE 1149.1)
Operating Temperature — -40C to +85C (industrial)
Lead-Free / RoHS — Non-compliant (legacy PLCC, SnPb finish)
Logic Block Architecture — Continuous FastTrack interconnect with EABs

Datasheets & Resources

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