EPF8452ATC100-3 vs EPF8452ATC100-3N Comparison
Detailed side-by-side comparison of EPF8452ATC100-3 by Intel and EPF8452ATC100-3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF8452ATC100-3 | EPF8452ATC100-3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Family | FLEX 8000 | FLEX 8000 |
| Usable Gates | 4,000 | approximately 4,000 |
| Logic Elements (LEs) | 336 | — |
| Logic Array Blocks (LABs) | 42 | — |
| Flip-Flops / Registers | 452 | — |
| User I/Os | 78 | 78 |
| Supply Voltage | 4.75 V to 5.25 V (5 V nominal) | 5 V (4.75 V to 5.25 V) |
| Internal Operating Frequency | 125 MHz | — |
| Process Technology | 0.42 µm CMOS SRAM | 0.42 µm CMOS SRAM |
| Package | 100-pin TQFP (14x14 mm) | 100-pin TQFP |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0 °C to +70 °C (Commercial) | 0 °C to 70 °C (commercial) |
| Configuration Method | Serial/parallel EPROM, EPC1, EPC1213, EPC1064, EPC1441, or system controller | SRAM, in-circuit reconfigurable (EPC1/EPC1064/EPC1213/EPC1441 or parallel EPROM) |
| In-Circuit Reconfigurability | Yes (ICR via SRAM) | — |
| RoHS Status | [DATA_NEEDED: RoHS status - not present in verified web data] | [DATA_NEEDED: rohs status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Logic Elements / Cells | — | 336 |
| Number of LABs/CLBs | — | 42 |
| Maximum Internal Frequency | — | 125 MHz |
| I/O Standard | — | 5 V CMOS, PCI-compliant drive |
| Logic Family | — | CMOS |