EPF8452ATC100-3N - FLEX 8000 FPGA, 4K Gates, 100-TQFP | Intel
MPN: EPF8452ATC100-3N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $24.4 | $244.00 |
| 100 | $19.9 | $1,990.00 |
| 500 | $16.2 | $8,100.00 |
| 1,000 | $13.75 | $13,750.00 |
Drop-in alternatives for EPF8452ATC100-3N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EPF8452ATC100-3
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View Datasheet βEPF6016ATC100-3N
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View Datasheet βEPF8452ATC100-3N Maximum Ratings & Electrical Characteristics
| Family | FLEX 8000 |
| Logic Elements / Cells | 336 |
| Number of LABs/CLBs | 42 |
| Usable Gates | approximately 4,000 |
| User I/Os | 78 |
| Supply Voltage | 5 V (4.75 V to 5.25 V) |
| Process Technology | 0.42 Β΅m CMOS SRAM |
| Operating Temperature | 0 Β°C to 70 Β°C (commercial) |
| Maximum Internal Frequency | 125 MHz |
| Package | 100-pin TQFP |
| Mounting Type | Surface Mount |
| Configuration Method | SRAM, in-circuit reconfigurable (EPC1/EPC1064/EPC1213/EPC1441 or parallel EPROM) |
| I/O Standard | 5 V CMOS, PCI-compliant drive |
| Logic Family | CMOS |
EPF8452ATC100-3N Pin Configuration
| Pin 1 | I/O β User I/O (bank-dependent function per datasheet) |
| Pin 10 | I/O β User I/O |
| Pin 11 | I/O β User I/O |
| Pin 12 | I/O β User I/O |
| Pin 13 | I/O β User I/O |
| Pin 14 | I/O β User I/O |
| Pin 15 | GND β Ground |
| Pin 16 | I/O β User I/O |
| Pin 17 | I/O β User I/O |
| Pin 18 | I/O β User I/O |
| Pin 19 | I/O β User I/O |
| Pin 2 | I/O β User I/O |
| Pin 20 | I/O β User I/O |
| Pin 21 | VCC β 5 V supply |
| Pin 22 | I/O β User I/O |
| Pin 23 | I/O β User I/O |
| Pin 24 | I/O β User I/O |
| Pin 25 | I/O β User I/O |
| Pin 26 | I/O β User I/O |
| Pin 27 | I/O β User I/O |
| Pin 28 | GND β Ground |
| Pin 29 | I/O β User I/O |
| Pin 3 | I/O β User I/O |
| Pin 30 | I/O β User I/O |
| Pin 31 | I/O β User I/O |
| Pin 32 | I/O β User I/O |
| Pin 33 | I/O β User I/O |
| Pin 34 | VCC β 5 V supply |
| Pin 35 | I/O β User I/O |
| Pin 36 | I/O β User I/O |
| Pin 37 | I/O β User I/O |
| Pin 38 | I/O β User I/O |
| Pin 39 | I/O β User I/O |
| Pin 4 | I/O β User I/O |
| Pin 40 | GND β Ground |
| Pin 41 | nCONFIG β Configuration control (active-low) |
| Pin 42 | nSTATUS β Configuration status (active-low) |
| Pin 43 | CONF_DONE β Configuration done indicator |
| Pin 44 | DCLK β Configuration clock input |
| Pin 45 | DATA0 β Configuration data input |
| Pin 46 | MSEL1 β Configuration mode select 1 |
| Pin 47 | MSEL0 β Configuration mode select 0 |
| Pin 48 | I/O β User I/O |
| Pin 49 | I/O β User I/O |
| Pin 5 | I/O β User I/O |
| Pin 50 | VCC β 5 V supply |
| Pin 51 | I/O β User I/O |
| Pin 52 | I/O β User I/O |
| Pin 53 | I/O β User I/O |
| Pin 54 | I/O β User I/O |
| Pin 55 | I/O β User I/O |
| Pin 56 | I/O β User I/O |
| Pin 57 | GND β Ground |
| Pin 58 | I/O β User I/O |
| Pin 59 | I/O β User I/O |
| Pin 6 | I/O β User I/O |
| Pin 60 | I/O β User I/O |
| Pin 61 | I/O β User I/O |
| Pin 62 | I/O β User I/O |
| Pin 63 | I/O β User I/O |
| Pin 64 | I/O β User I/O |
| Pin 65 | VCC β 5 V supply |
| Pin 66 | I/O β User I/O |
| Pin 67 | I/O β User I/O |
| Pin 68 | I/O β User I/O |
| Pin 69 | I/O β User I/O |
| Pin 7 | I/O β User I/O |
| Pin 70 | GND β Ground |
| Pin 71 | I/O β User I/O |
| Pin 72 | I/O β User I/O |
| Pin 73 | I/O β User I/O |
| Pin 74 | I/O β User I/O |
| Pin 75 | I/O β User I/O |
| Pin 76 | I/O β User I/O |
| Pin 77 | I/O β User I/O |
| Pin 78 | VCC β 5 V supply |
| Pin 79 | TDI β JTAG test data input |
| Pin 8 | I/O β User I/O |
| Pin 80 | TMS β JTAG test mode select |
| Pin 81 | TCK β JTAG test clock |
| Pin 82 | TDO β JTAG test data output |
| Pin 83 | I/O β User I/O |
| Pin 84 | I/O β User I/O |
| Pin 85 | I/O β User I/O |
| Pin 86 | GND β Ground |
| Pin 87 | I/O β User I/O |
| Pin 88 | I/O β User I/O |
| Pin 89 | I/O β User I/O |
| Pin 9 | I/O β User I/O |
| Pin 90 | I/O β User I/O |
| Pin 91 | I/O β User I/O |
| Pin 92 | VCC β 5 V supply |
| Pin 93 | I/O β User I/O |
| Pin 94 | I/O β User I/O |
| Pin 95 | I/O β User I/O |
| Pin 96 | I/O β User I/O |
| Pin 97 | I/O β User I/O |
| Pin 98 | GND β Ground |
| Pin 99 | I/O β User I/O |
| Pin 100 | I/O β User I/O |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPF8452ATC100-3N is suitable for 6 applications: PCI Bus Interface Bridge, Industrial Control Glue Logic Consolidation, Telecommunications Line-Card Interface Logic, Legacy 74-Series Logic Replacement, Prototyping Platform for Custom State Machines, Test and Measurement Front-End Logic.
PCI Bus Interface Bridge
The EPF8452ATC100-3N's 5 V PCI-compliant I/O drive strength and 78 user I/Os make it well suited for legacy PCI bus interface bridging between a host controller and peripheral glue logic. With 4,000 usable gates and 42 LABs, it can implement target-state machines, address decoding, interrupt steering, and byte-enable logic in a single 100-TQFP device. The 125 MHz internal frequency comfortably supports 33 MHz PCI timing budgets. Designers place the FPGA between the PCI connector and an application-specific ASIC or microcontroller, using Quartus II for synthesis and timing closure. Its 5 V CMOS I/O eliminates the need for level shifters on the PCI bus side, simplifying PCB routing. Configuration via an EPC1 or EPC1441 serial PROM allows autonomous power-up without host intervention.
Recommended
Industrial Control Glue Logic Consolidation
In industrial control boards, the EPF8452ATC100-3N replaces dozens of 74-series discrete logic ICs by integrating address decoding, bus arbitration, watchdog timers, and I/O expansion into a single 100-TQFP device. The 78 user I/Os support direct connection to many sensors, optocouplers, and relay drivers, reducing board area and BOM cost. Industrial systems benefit from the part's 0 Β°C to 70 Β°C commercial temperature range when housed in controlled enclosures. The in-circuit reconfigurability of FLEX 8000 allows field firmware updates via JTAG, useful for late-stage protocol changes without board rework. Engineers should add a small EEPROM-style configuration device and ensure clean 5 V supply decoupling for reliable operation in electrically noisy industrial environments.
Recommended
Telecommunications Line-Card Interface Logic
Telecommunications line cards historically rely on FLEX 8000 devices such as the EPF8452ATC100-3N to implement TDM bus formatting, framer/mapper glue, clock-domain crossing, and hardware-protocol adaptation between line-interface units and switch-fabric ASICs. With 4,000 usable gates, the device comfortably fits state machines for HDB3/AMI encoding, slip-buffer control, and alarm-collection registers. Its 5 V tolerant CMOS I/O connects directly to legacy telecom backplanes without external level shifters. The 100-TQFP footprint supports standard SMT assembly lines, while the 78 I/Os are sufficient to drive multi-protocol serial buses. Designers should validate timing closure with Quartus II and use a configuration EPROM sized for the compiled bitstream.
Recommended
Legacy 74-Series Logic Replacement
The EPF8452ATC100-3N is a strong candidate when modernizing legacy boards that contain many discrete 74LS/74HC/74F TTL packages. The 4,000 usable gates and 78 user I/Os can absorb the equivalent of 20-40 small-scale and medium-scale ICs in a single chip, dramatically reducing PCB complexity and assembly cost. Designers capture the original schematic logic into Quartus II using either VHDL, Verilog, or schematic-entry netlists, then target the FLEX 8000 device directly. The 100-TQFP pinout fits standard 1.6 mm board stack-ups, and the 5 V I/O is drop-in compatible with the TTL rails it replaces. In-circuit reconfigurability allows incremental logic fixes without board spin.
Recommended
Prototyping Platform for Custom State Machines
Engineering teams use the EPF8452ATC100-3N as a fast-prototyping platform for custom state machines, FIFO controllers, and protocol converters in the 100-TQFP form factor. The 125 MHz internal frequency and Quartus II synthesis flow enable iterative design cycles measured in hours rather than weeks. The 78 user I/Os are accessible on standard 0.5 mm-pitch TQFP land patterns, simplifying breakout-board integration. Because FLEX 8000 supports SRAM-based in-circuit reconfigurability, a single board can host multiple design revisions simply by reprogramming the configuration EPROM. This makes it ideal for FPGA-meets-ASIC proof-of-concept work where designers need a quick hardware target before committing to a masked gate array.
Recommended
Test and Measurement Front-End Logic
Test and measurement instruments often use FLEX 8000 devices such as the EPF8452ATC100-3N for front-end channel switching, trigger logic, timing generators, and counter pre-scalers. The 4,000 usable gates are sufficient for 8-to-16 channel mux trees, while 78 I/Os interface directly to ADC/DAC and comparator front-ends. The 5 V supply rails simplify integration with op-amps and analog multiplexers that still run on Β±5 V or single 5 V rails. PCI-compliant drive strength also supports insertion into PXI/cPCI measurement chassis via a bridge interface. Configuration is straightforward with an EPC1 or EPC1064, and the 100-TQFP package handles reflow assembly on standard 1.6 mm FR-4 boards.
Recommended
Recommended Products Summary
Engineering reference data for EPF8452ATC100-3N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF8452ATC100-3 | EPF8452ATC100-4N | EPF8282ATC100-3 | EPF6016ATC100-3N |
|---|---|---|---|---|---|
| Package | 100-TQFP | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Family | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 6000 |
| Usable Gates | ~4,000 | ~4,000 | ~4,000 | ~2,500 | ~16,000 |
| Logic Cells | 336 | 336 | 336 | 208 | 1,320 |
| User I/Os | 78 | 78 | 78 | ~68 | 81 |
| Speed Grade | -3 | -3 | -4 (slower) | -3 | -3 |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
Key Differentiators
- Higher logic density within the same 100-TQFP footprint (vs EPF8282ATC100-3)
- Same-package FLEX 8000 family drop-in compatibility (vs EPF8452ATC100-4N)
- Mature, well-documented 5 V PCI-capable I/O (vs EPF6016ATC100-3N)
Design Notes
EPF8452ATC100-3N requires a clean 5 V Β±5% supply. Place a 0.1 Β΅F ceramic decoupling capacitor adjacent to every VCC pin and a 10 Β΅F bulk tantalum or ceramic at the package entry. Because the device draws surge current during configuration, ensure the upstream regulator can supply at least 200 mA peak. Decoupling the JTAG and configuration pins separately prevents configuration failures caused by supply bounce.
Use a 4-layer PCB with a continuous ground plane beneath the 100-TQFP footprint. Keep configuration traces (DCLK, DATA0, nCONFIG, nSTATUS, CONF_DONE) under 50 mm and away from switching signals. Route user I/O differential pairs with matched lengths if used for clock distribution. Provide a 100 Ξ© differential termination on TCK if JTAG cable length exceeds 150 mm to avoid signal-integrity issues.
Do not leave MSEL0/MSEL1 floating - they select the configuration mode (passive serial vs. parallel) and an undefined state can prevent the device from configuring. Tie CONF_DONE high through a 10 kΞ© resistor to VCC for proper power-on behavior. Remember that FLEX 8000 configuration is volatile: the device loses its logic on every power-down, so a configuration EPROM (EPC1/EPC1064/EPC1213/EPC1441) is mandatory for autonomous operation.
Compliance Information
RoHS/REACH/halogen-free status not specified in verified web data. EPF8452ATC100-3N is a legacy 5 V FPGA in a commercial temperature grade; the lead-free variant is the EPF8452ATC100-3 suffix. AEC-Q100 not applicable as this is a commercial-grade programmable logic device.