EPF8452ATC100-3N vs EPF6016ATC100-3N Comparison

Detailed side-by-side comparison of EPF8452ATC100-3N by Intel and EPF6016ATC100-3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF8452ATC100-3N EPF6016ATC100-3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Family FLEX 8000 FLEX 6000
Logic Elements / Cells 336 —
Number of LABs/CLBs 42 —
Usable Gates approximately 4,000 —
User I/Os 78 81
Supply Voltage 5 V (4.75 V to 5.25 V) 3.3 V
Process Technology 0.42 µm CMOS SRAM —
Operating Temperature 0 °C to 70 °C (commercial) 0C to 85C (TJ)
Maximum Internal Frequency 125 MHz —
Package 100-pin TQFP 100-pin TQFP (14x14 mm)
Mounting Type Surface Mount Surface Mount
Configuration Method SRAM, in-circuit reconfigurable (EPC1/EPC1064/EPC1213/EPC1441 or parallel EPROM) —
I/O Standard 5 V CMOS, PCI-compliant drive —
RoHS Status [DATA_NEEDED: rohs status] [DATA_NEEDED: RoHS status]
Logic Family CMOS —
Device Type — SRAM-based FPGA
Typical Gates — 16,000
Logic Elements (LEs) — 1,320
Logic Array Blocks (LABs) — 132
Internal Operating Frequency — 142.86 MHz (max)
Technology Node — 0.42 um CMOS
Configuration — SRAM (volatile)
Programming Interface — JTAG / FLEX configuration

Datasheets & Resources

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