EPF8636AQC160-3 vs EPF8636AQC208-2 Comparison

Detailed side-by-side comparison of EPF8636AQC160-3 by Intel and EPF8636AQC208-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF8636AQC160-3 EPF8636AQC208-2
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Family FLEX 8000 FLEX 8000
Usable Gates 6,000 —
Logic Cells / Elements 504 —
Logic Array Blocks (LABs) 63 —
User I/Os 118 —
Embedded SRAM 4,992 bits —
Maximum Frequency 125 MHz —
Process Technology 0.42 µm CMOS 0.42 µm CMOS SRAM
Supply Voltage 5 V (4.75 V to 5.25 V) —
Operating Temperature 0 °C to +70 °C (Commercial) 0 °C to 70 °C (Commercial)
Package 160-pin PQFP / BQFP (28 × 28 mm) 208-BQFP / 208-PQFP (Plastic Quad Flat Pack)
Mounting Type Surface Mount (Gull-Wing) Surface Mount
Configuration Method SRAM, JTAG (IEEE 1149.1) / Serial EPROM SRAM - serial or parallel EPROM, EPC1/EPC1064/EPC1213/EPC1441, or system controller
Boundary-Scan Support Yes (JTAG) —
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance status]
Series — FLEX 8000
Number of Logic Elements/Cells — 504
Number of Gates — 6000
Number of LABs/CLBs — 63
Number of I/O — 136
Operating Supply Voltage — 4.75 V to 5.25 V
Logic Family — CMOS
In-Circuit Reconfigurability — Yes (ICR via SRAM configuration)
Lifecycle Status — Obsolete (EOL)

Datasheets & Resources

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