EPM240ZM68C6N vs EPM240ZM68I8N Comparison
Detailed side-by-side comparison of EPM240ZM68C6N by Intel and EPM240ZM68I8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPM240ZM68C6N | EPM240ZM68I8N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Family | MAX II Z (CPLD) | MAX II Z (Zero Power) |
| Macrocells | 192 | 192 |
| Logic Elements (LE) | 240 | — |
| Maximum Propagation Delay (tPD) | 7.5 ns | — |
| Internal Performance (fMAX) | 184.1 MHz | — |
| Process Technology | 0.18 µm | — |
| User I/O Count | 80 | — |
| Number of I/O Banks | 4 | — |
| Core Supply Voltage (VCCINT) | 1.8 V | — |
| I/O Supply Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (banked) | — |
| Package | 68-ball Micro FBGA (MBGA-68) | 68-ball MBGA (Z) |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Configuration Memory | On-chip flash (non-volatile, instant-on) | On-chip flash (non-volatile) |
| Programming Interface | JTAG (IEEE 1149.1 / IEEE 1532) | — |
| Operating Temperature Range | -40°C to +85°C (commercial, 'C' suffix) | — |
| RoHS Status | Compliant | Compliant |
| Lead-Free Finish | Yes | — |
| MSL Level | 3 (per JEDEC J-STD-020) | 3 |
| Series | — | MAX II |
| Logic Elements | — | 240 |
| User Flash Memory | — | 8 Kbits |
| Global Clock Networks | — | 4 |
| Maximum User I/O Pins | — | [DATA_NEEDED: maximum user I/O count for MBGA-68 package] |
| Core Voltage | — | 1.8 V |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI 66 MHz 32-bit, SSTL-2 |
| Propagation Delay (tPD) | — | [DATA_NEEDED: tPD1 / tPD2 from datasheet] |
| Operating Temperature | — | -40 °C to +100 °C (Industrial) |
| In-System Programming | — | Yes (JTAG, IEEE 1149.1) |
| Hot Socketing | — | Yes |