EPM240ZM68I8N - 240-Logic Element MAX II CPLD | Intel
MPN: EPM240ZM68I8N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $14.85 | $14.85 |
| 10 | $13.2 | $132.00 |
| 100 | $11.45 | $1,145.00 |
| 500 | $10.1 | $5,050.00 |
| 1,000 | $8.95 | $8,950.00 |
Drop-in alternatives for EPM240ZM68I8N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EPM240ZM68C7N
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View Datasheet βEPM240ZM68C6N
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View Datasheet βEPM240ZM68I8N Maximum Ratings & Electrical Characteristics
| Series | MAX II |
| Family | MAX II Z (Zero Power) |
| Logic Elements | 240 |
| Macrocells | 192 |
| User Flash Memory | 8 Kbits |
| Global Clock Networks | 4 |
| Core Voltage | 1.8 V |
| I/O Standards Supported | LVTTL, LVCMOS, PCI 66 MHz 32-bit, SSTL-2 |
| Operating Temperature | -40 Β°C to +100 Β°C (Industrial) |
| Package | 68-ball MBGA (Z) |
| Mounting Type | Surface Mount |
| MSL Level | 3 |
| Configuration Memory | On-chip flash (non-volatile) |
| In-System Programming | Yes (JTAG, IEEE 1149.1) |
| Hot Socketing | Yes |
| RoHS Status | Compliant |
EPM240ZM68I8N Pin Configuration
| Pin A1 | I/O β User I/O bank 1 |
| Pin A2 | I/O β User I/O bank 1 |
| Pin A3 | VCCIO1 β I/O bank 1 supply (1.5/1.8/2.5/3.3 V) |
| Pin A4 | I/O β User I/O bank 1 |
| Pin A5 | GND β Ground |
| Pin A6 | I/O β User I/O bank 1 |
| Pin A7 | I/O β User I/O bank 1 |
| Pin A8 | VCCIO1 β I/O bank 1 supply |
| Pin B1 | I/O β User I/O bank 2 |
| Pin B2 | I/O β User I/O bank 2 |
| Pin B3 | I/O β User I/O bank 2 |
| Pin B4 | I/O β User I/O bank 2 |
| Pin B5 | VCCIO2 β I/O bank 2 supply |
| Pin B6 | I/O β User I/O bank 2 |
| Pin B7 | I/O β User I/O bank 2 |
| Pin B8 | I/O β User I/O bank 2 |
| Pin C1 | I/O β User I/O bank 3 |
| Pin C2 | I/O β User I/O bank 3 |
| Pin C3 | I/O β User I/O bank 3 |
| Pin C4 | TDI β JTAG Test Data In |
| Pin C5 | TCK β JTAG Test Clock |
| Pin C6 | TMS β JTAG Test Mode Select |
| Pin C7 | I/O β User I/O bank 3 |
| Pin C8 | I/O β User I/O bank 3 |
| Pin D1 | GND β Ground |
| Pin D2 | I/O β User I/O bank 3 |
| Pin D3 | I/O β User I/O bank 3 |
| Pin D4 | TDO β JTAG Test Data Out |
| Pin D5 | GND β Ground |
| Pin D6 | I/O β User I/O bank 4 |
| Pin D7 | I/O β User I/O bank 4 |
| Pin D8 | VCCIO4 β I/O bank 4 supply |
| Pin E1 | I/O β User I/O bank 3 |
| Pin E2 | VCCINT β Core 1.8 V supply |
| Pin E3 | I/O β User I/O bank 3 |
| Pin E4 | I/O β User I/O bank 4 |
| Pin E5 | I/O β User I/O bank 4 |
| Pin E6 | I/O β User I/O bank 4 |
| Pin E7 | VCCINT β Core 1.8 V supply |
| Pin E8 | I/O β User I/O bank 4 |
| Pin F1 | I/O β User I/O bank 3 |
| Pin F2 | I/O β User I/O bank 3 |
| Pin F3 | GND β Ground |
| Pin F4 | I/O β User I/O bank 4 |
| Pin F5 | I/O β User I/O bank 4 |
| Pin F6 | VCCIO3 β I/O bank 3 supply |
| Pin F7 | I/O β User I/O bank 4 |
| Pin F8 | I/O β User I/O bank 4 |
| Pin G1 | I/O β User I/O bank 1 |
| Pin G2 | I/O β User I/O bank 1 |
| Pin G3 | I/O β User I/O bank 1 |
| Pin G4 | GND β Ground |
| Pin G5 | I/O β User I/O bank 2 |
| Pin G6 | I/O β User I/O bank 2 |
| Pin G7 | I/O β User I/O bank 2 |
| Pin G8 | I/O β User I/O bank 2 |
| Pin H1 | I/O β User I/O bank 1 |
| Pin H2 | VCCIO1 β I/O bank 1 supply |
| Pin H3 | I/O β User I/O bank 1 |
| Pin H4 | I/O β User I/O bank 1 |
| Pin H5 | I/O β User I/O bank 2 |
| Pin H6 | I/O β User I/O bank 2 |
| Pin H7 | VCCIO2 β I/O bank 2 supply |
| Pin H8 | I/O β User I/O bank 2 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM240ZM68I8N is suitable for 7 applications: I/O Expansion for Embedded Processors, Bus Bridging (Legacy to Modern Processors), Power Supply Sequencing, Industrial Control and Factory Automation, Portable and Battery-Powered Devices, Glue Logic Replacement, Medical Device Interface Boards.
I/O Expansion for Embedded Processors
The EPM240ZM68I8N is widely used as a low-density I/O expander on STM32, NXP i.MX, and Microchip PIC32 boards where the host MCU lacks GPIO, UART, SPI, or PWM peripherals. Its 240 logic elements and MultiVolt I/O banks for 1.5 V to 3.3 V allow direct interface to 3.3 V MCUs while running a 1.8 V core, eliminating level shifters. The non-volatile flash configuration means instant-on at power-up with zero boot latency, and the 68-ball MBGA keeps the footprint smaller than a TQFP CPLD alternative, which is critical in handheld designs.
Recommended
Bus Bridging (Legacy to Modern Processors)
The EPM240ZM68I8N excels at bridging legacy 8-bit or 16-bit peripheral buses (e.g., PC/104, ISA, 8051-style multiplexed buses) to modern 32-bit ARM Cortex processors. Its 4 global clock networks and 192 macrocells are sufficient to implement glue logic, address-latch demultiplexing, and chip-select decoders, while the 8 Kbits of user flash can hold board-identity or revision metadata. Hot-socketing allows live insertion into backplane systems without disturbing adjacent cards, making it well-suited for modular industrial PCs and PXI chassis.
Recommended
Power Supply Sequencing
Multi-rail systems powering FPGAs, ASICs, or processors need strict rail-on and rail-off sequencing to avoid latch-up. The EPM240ZM68I8N's instant-on flash configuration boots in microseconds without boot ROM, allowing it to drive discrete MOSFET gates or enable pins of downstream POL regulators immediately at VCC_INT ramp-up. Four global clock pins can also be repurposed as general-purpose output enables, and the 240 logic elements comfortably handle sequencing for 4-6 rails with PG (power-good) feedback. The industrial -40 Β°C to +100 Β°C temperature grade fits outdoor telecom and industrial racks.
Recommended
Industrial Control and Factory Automation
Factory automation controllers, PLCs, and motor-control boards benefit from the EPM240ZM68I8N's industrial -40 Β°C to +100 Β°C operating range and zero-standby-power flash CPLD architecture. It implements encoder decoding, PWM generation, fault-logic aggregation, and isolated fieldbus glue (Modbus, RS-485, CAN interfaces). The JTAG boundary-scan support accelerates production test, while the hot-socketing capability supports live insertion into DIN-rail backplanes. Compared to a discrete 74HC logic implementation, the CPLD reduces board area and BOM cost substantially.
Recommended
Portable and Battery-Powered Devices
The MAX II Z Zero-Power architecture of the EPM240ZM68I8N draws microamps of standby current, making it ideal for handheld test equipment, portable medical instruments, and energy-harvesting IoT edge nodes. The non-volatile flash configuration eliminates the always-on boot-PROM current typical of SRAM-based FPGAs, extending battery life by 5-10% versus an FPGA doing the same glue-logic function. The 68-ball MBGA 1.27 mm pitch package supports miniaturized PCB layouts where every square millimeter counts.
Recommended
Glue Logic Replacement
Replacing discrete 74HC/74LVC logic gates, latches, and decoders with a single EPM240ZM68I8N reduces board area by 50-70% and eliminates dozens of traces. Engineers commonly migrate 74LS138 decoders, 74HC245 transceivers, 74HC151 multiplexers, and D-type flip-flop arrays into a MAX II Z CPLD. The Quartus schematic capture and HDL flow make porting straightforward, and the JTAG ISP allows post-assembly design changes without re-spinning boards - ideal for prototypes and low-volume production where respins are prohibitively expensive.
Recommended
Medical Device Interface Boards
Medical device front-ends with patient-isolation barriers, sensor multiplexing, and LCD/LED drivers benefit from the EPM240ZM68I8N's deterministic propagation delay and zero-standby flash configuration. The device aggregates multiple low-speed analog front-end signals, generates timing for optocouplers, and provides fail-safe defaults at power-up without configuration latency. The industrial temperature grade supports clinical equipment operating in controlled but variable-temperature environments. Combined with the small 68-ball MBGA footprint, the EPM240Z is well-suited for compact patient monitors and portable diagnostic tools.
Recommended
Recommended Products Summary
Engineering reference data for EPM240ZM68I8N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM240ZM68C7N | EPM240ZM68C6N | EPM240ZM100I8N |
|---|---|---|---|---|
| Package | 68-ball MBGA (Z) | 68-ball MBGA (Z) - same | 68-ball MBGA (Z) - same | 100-ball MBGA - NOT same |
| Brand | Intel | Intel - same | Intel - same | Intel - same |
| Logic Elements | 240 | 240 | 240 | 240 |
| Operating Temperature | -40 Β°C to +100 Β°C (Industrial) | 0 Β°C to +70 Β°C (Commercial) | 0 Β°C to +70 Β°C (Commercial) | -40 Β°C to +100 Β°C (Industrial) |
| Speed Grade | I8 (fastest industrial) | C7 | C6 (slower) | I8 |
| User Flash | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Pin Compatibility | 68-ball MBGA (reference) | Yes - drop-in | Yes - drop-in | No - different 100-ball package |
Key Differentiators
- Zero-standby-power flash configuration vs SRAM FPGAs (vs Xilinx XC2C64A (CoolRunner-II))
- Instant-on with on-chip memory vs external boot PROM (vs Lattice ispMACH 4032ZE)
- MultiVolt I/O bank support for mixed-voltage designs (vs Older 5 V-only CPLDs)
Design Notes
The 68-ball MBGA package uses a 1.27 mm ball pitch array. Use 4-layer PCB with continuous GND and VCC_INT planes directly under the BGA to provide low-impedance return paths. Place 0.1 Β΅F decoupling caps within 100 mils of each VCCIO bank pin, with a single 10 Β΅F bulk capacitor near the device. Avoid routing signal traces under the BGA balls; escape through the inner rows to top-layer microvia-in-pad if manufacturing capability allows.
Decoupling strategy: place 0.1 Β΅F X7R 0402 caps on every VCCINT and VCCIO ball, plus a 4.7 Β΅F bulk capacitor near the device. Keep JTAG traces short (< 50 mm) and away from switching converters. For hot-socketing reliability, add 10 kΞ© pull-ups on JTAG pins (TCK, TMS, TDI) and a 10 kΞ© pull-down on TDO to ensure defined states during board insertion into a live backplane.
Common pitfalls: (1) Forgetting to set unused I/O pins as inputs with weak pull-ups - this draws extra current and risks oscillation. (2) Driving JTAG signals with logic that does not support MultiVolt levels - ensure your JTAG programmer is 3.3 V tolerant. (3) Mixing VCCIO bank voltages without proper sequencing - ramp all bank supplies together to avoid I/O latch-up. (4) Using the wrong Quartus fitter settings for the MBGA package - specify the 68-ball MBGA explicitly in the pin assignment dialog.
Compliance Information
RoHS and REACH compliant per Intel product page. Lead-free and halogen-free per MAX II device handbook. Not AEC-Q100 qualified - this is a commercial/industrial part; for automotive applications consult Intel's MAX V or MAX 10 automotive-grade CPLDs. Conflict-minerals compliant per Intel supplier declarations.
