EPM240ZM68I8N vs EPM240ZM68C6N Comparison

Detailed side-by-side comparison of EPM240ZM68I8N by Intel and EPM240ZM68C6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPM240ZM68I8N EPM240ZM68C6N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Series MAX II —
Family MAX II Z (Zero Power) MAX II Z (CPLD)
Logic Elements 240 —
Macrocells 192 192
User Flash Memory 8 Kbits —
Global Clock Networks 4 —
Maximum User I/O Pins [DATA_NEEDED: maximum user I/O count for MBGA-68 package] —
Core Voltage 1.8 V —
I/O Standards Supported LVTTL, LVCMOS, PCI 66 MHz 32-bit, SSTL-2 —
Propagation Delay (tPD) [DATA_NEEDED: tPD1 / tPD2 from datasheet] —
Operating Temperature -40 °C to +100 °C (Industrial) —
Package 68-ball MBGA (Z) 68-ball Micro FBGA (MBGA-68)
Mounting Type Surface Mount Surface Mount (BGA)
MSL Level 3 3 (per JEDEC J-STD-020)
Configuration Memory On-chip flash (non-volatile) On-chip flash (non-volatile, instant-on)
In-System Programming Yes (JTAG, IEEE 1149.1) —
Hot Socketing Yes —
RoHS Status Compliant Compliant
Logic Elements (LE) — 240
Maximum Propagation Delay (tPD) — 7.5 ns
Internal Performance (fMAX) — 184.1 MHz
Process Technology — 0.18 µm
User I/O Count — 80
Number of I/O Banks — 4
Core Supply Voltage (VCCINT) — 1.8 V
I/O Supply Voltage (VCCIO) — 1.5 V / 1.8 V / 2.5 V / 3.3 V (banked)
Programming Interface — JTAG (IEEE 1149.1 / IEEE 1532)
Operating Temperature Range — -40°C to +85°C (commercial, 'C' suffix)
Lead-Free Finish — Yes

Datasheets & Resources

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